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SMART CUT® Diamond Wire Spools, also known as bobbin-based diamond wire, are specifically designed for extended, continuous cutting operations. They are ideal for processing large ingots, slabs, and blocks where long cutting paths are required. Unlike looped wire systems, spool-based wire is wound onto reels and fed continuously through the workpiece, meaning that fresh abrasive sections are always in contact with the material. This feature ensures steady cutting performance and consistent quality across very long cuts, making the method indispensable for heavy-duty production environments.
Because the wire is consumable, spool systems trade higher wire usage for the ability to cut materials that loop systems cannot accommodate, such as silicon ingots for photovoltaics, large stone slabs, ceramics, and advanced composites. Their design enables stable operation under high tension and extended lengths, making them a practical and scalable solution for industrial-scale applications.
Another major advantage is process consistency. As the worn wire exits the cutting zone, a new section immediately takes over, eliminating interruptions and maintaining sharpness throughout the operation. This results in cleaner kerfs, reduced downtime, and improved throughput. Furthermore, spool systems are generally more cost-effective in terms of equipment investment when compared to closed-loop wire machines, even though operating costs are higher due to wire consumption.
With their flexibility across multiple industries, ability to handle large-format materials, and compatibility with different bond types (electroplated for aggressive cuts, resin bond for smoother finishes, and slurry-based for legacy systems), Diamond Wire Spools remain one of the most reliable tools for manufacturers seeking to balance productivity with quality in demanding cutting operations.
Wire Outer Diameter: 50–520 µm
Core Diameter: 40–400 µm
Diamond Grit Size: 5–50 µm
Tensile Strength: 6–320 N
Spool Lengths: 30–1000 m (custom lengths available)
Minimum Pulley Diameter: 40–250 mm
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Diamond Wire Spools offer several benefits that make them the preferred option for large-scale cutting:
Diamond Wire Spools are widely used in industrial-scale operations where large blocks and high throughput are required. Typical applications include:
Diamond Wire Spools are available in different bond types to suit application requirements:
|
Item No. |
Diamond Wire Diameter (mm) |
Steel Wire Diameter (mm) |
Tolerance (±mm) |
Break Tension (N) |
Diamond Diameter |
Spool Wire Tension at Winding (N) |
Pitch (mm) |
Diamond Concentration (pcs/mm) |
Application Reference |
|---|---|---|---|---|---|---|---|---|---|
| A (9020125) |
0.125 |
0.10 |
0.005 |
30N |
10 µm |
10 ± 1 |
0.5–0.6 |
40–60 |
Slice silicon, crystal, and others |
| B (9020145) | 0.145 |
0.12 |
0.005 |
40N |
10 µm |
10 ± 1 |
0.5–0.6 |
40–60 |
Slice silicon, crystal, and others |
| C (9020025) |
0.25 |
0.18 |
0.01 |
75N |
30–40 µm |
15 ± 1 |
0.5–0.6 |
20–30 |
Slice sapphire, CaF₂, crystal, glass, W alloy, NdFeB, and others |
| D (9020031) |
0.31 |
0.22 |
0.01 |
140N |
30–40 µm |
15 ± 1 |
0.5–0.6 |
70–90 |
Crop silicon, sapphire, cut filament, and others |
| E (9020035) |
0.35 |
0.25 |
0.02 |
160N |
40–50 µm |
15 ± 1 |
0.5–0.6 |
30–40 |
Square silicon and others |
| F (9020037) |
0.37 |
0.27 |
0.02 |
190N |
40–50 µm |
15 ± 1 |
0.5–0.6 |
30–40 |
Square silicon and others |
| G (9020042) |
0.42 |
0.32 |
0.02 |
230N |
40–50 µm |
15 ± 1 |
0.5–0.6 |
30–40 |
Square silicon and others |
Diamond wire is used because it offers a highly controlled and efficient method of cutting hard and brittle materials while maintaining accuracy and surface integrity. Unlike traditional cutting tools, diamond wire distributes force evenly along its length, which reduces stress, vibration, and heat on the material.
This makes it possible to achieve thin kerf widths, often less than 25 microns, and produce smooth surfaces with minimal chipping or microcracking. The process generates very little heat, typically less than a 10°F rise, which prevents thermal damage, warping, or subsurface fractures in sensitive materials such as semiconductors, sapphire, quartz, and ceramics. Diamond wire is also versatile, capable of cutting both delicate samples and large blocks, depending on the wire type and machine configuration.
It reduces material waste, often eliminates the need for secondary finishing, and offers longer tool life with the proper bond selection, making it a cost-effective and reliable choice for industries that demand precision, repeatability, and clean cutting results.
Electroplated diamond wire is made with a single layer of diamond particles bonded with nickel plating, providing very sharp cutting edges, aggressive performance, and high throughput. It is widely used for semiconductor wafers, sapphire, optical crystals, and glass substrates, where speed and precision are essential. The design ensures consistent sharpness and fast material removal
Electroplated (nickel bond) diamond products usually have a single layer of diamonds, held by a tough durable nickel alloy. Nickel is frequently used as a base for plating diamond. Because of its excellent strength, toughness and flexibility during the plating process. Electroplated diamond products are able to retain their original shape and dimensions thought their working life. Unlike sintered (meal bond) or resin bond diamond products, where diamond particles are buried in bond and held together by metal or resin binder deep inside. Electroplating allows diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation.
Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT® Bond Diamond Bond makes sure every diamond is in the right place. and at the right time, working where you need it most.
The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT® remains sharp and grow sharper with each cut, prolonging product life and consistent performance.
This advanced formulated open diamond bond design insures minimal chipping, fast
cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.
Wafering monocrystalline and polycrystalline silicon using diamond wire, despite its efficiency and precision, involves several challenges that can complicate the manufacturing process and affect output quality.
Firstly, achieving consistent quality in diamond wire itself is a significant challenge. Variations in the diamond coating, such as inconsistency in grain size or density, can lead to uneven wear and tear during cutting, affecting the quality of the wafers. Manufacturers must ensure that the diamond wire used is of high quality and consistently manufactured to avoid these issues.
Another major challenge is optimizing the cutting parameters, including wire speed, tension, and the volume and type of coolant used. These parameters must be precisely controlled to maximize cutting efficiency and minimize damage to the wafers. Incorrect settings can lead to wire breakage, excessive material loss, or suboptimal wafer surface quality, necessitating costly post-processing.
Wire breakage is a frequent issue and can cause significant disruptions in production. It often results from mechanical stress or from the wire becoming worn out. Regular monitoring and replacing of the wire is required to prevent unexpected downtime, which can be costly both in terms of production delays and material wastage.
Cooling and debris removal also pose challenges. The cutting process generates heat and silicon debris, which must be effectively managed with appropriate coolant systems. If cooling is insufficient, it can lead to overheating, which affects the structural integrity of the silicon wafers. Moreover, the spent coolant and debris need to be handled and disposed of in compliance with environmental standards, adding to the operational complexities.
Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT® Bond Diamond Bond makes sure every diamond is in the right place. and at the right time, working where you need it most.
The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT® remains sharp and grow sharper with each cut, prolonging product life and consistent performance.
This advanced formulated open diamond bond design insures minimal chipping, fast
cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.
SMART CUT® is a synthetic coolant specifically designed for the cutting of semiconductor materials, including sapphire, silicon, germanium, single-crystal SiC, and II-VI crystals. This coolant offers excellent cut rates and imparts outstanding surface finishes with reduced warp and total thickness variation (TTV). It is ideal for diamond abrasive cropping, squaring, and wafering of silicon ingots using ID, band, and wire saws. SMART CUT® HD-2B can also be used as a non-re-circulating edge grinding coolant or lubricant for silicon wafers and ingots.
SMART CUT® HD-2B Coolant enhances cutting performance by providing exceptional cooling and lubrication. The coolant's molecules interact with the cutting area, efficiently absorbing heat to prevent overheating.
While SMART CUT® HD-2B is not specifically designed to be mixed with water, its advanced formula works effectively in "once-through" systems, where it helps maintain optimal cutting conditions by reducing friction. This results in improved tool life, superior material quality, and smoother cuts. By dissipating heat effectively, SMART CUT® HD-2B minimizes tool wear, improves cut quality, and enables faster, more efficient cutting, all while ensuring a cleaner, more environmentally friendly process.
SMART CUT® HD-2B 2B acts as both a coolant and lubricant, effectively reducing heat generated by friction and minimizing surface tension. As a lubricant, it enhances the dispersion of material swarf, ensuring that swarf particles are effectively moved away from the diamond tool and cutting zone, preventing buildup within the kerf. The coolant's advanced formula works by bonding with the cutting area, helping to penetrate the kerf and flush out material debris, preventing chipping and internal cracking. Additionally, because SMART CUT® HD-2B keeps the cutting area clean and free from debris, it minimizes the need for secondary material processing and cleaning operations, enhancing overall efficiency and reducing maintenance requirements.
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25205 & 25201 Avenue Tibbits Valencia CA 91355 USA
Phone : (661) 257-2288
FAX : (661) 257 -3833
lel@ukam.com
UKAM Industrial Superhard Tools is a U.S. High Technology, Specialty Diamond Tool & Equipment manufacturer. We specialize in producing ultra thin, high precision cutting blades, precision cutting machines diamond drills, diamond micro tools, standard & custom advanced industrial diamond tools and consumables.
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