| Company
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DIAMOND
BACKGRINDING WHEELS - SMART CUT™ SERIES
NEW
GENERATION & TECHNOLOGY
Used on backgrinding machines
for thinning and flattening silicon wafers, glass products, ceramic
products. Sizes range from 8” to 14” O.D.
Used on machines
manufactured by Disco, Okamoto, Strasbaugh, and
many others.
Available in
large variety of bond such as sintered (metal bond), resin bond, vitrified
bond, plated (nickel bond). Specification
of diamond backgrinding wheel can be optimized to fit your particular application/material.
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Type
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Profile
sketch
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Common
Specifications
in
mm
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Diameter
D
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Thickness
T
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Inside
Diameter
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6A
2
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175
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30-35
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76
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200
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35
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76
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350
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45
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127
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6A
2T
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195
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22.5-25
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170
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280
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30
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228.6
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350
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35
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235
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6A
2T
(three
ellipses)
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209
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22.5-23
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158
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All
Dimensions: T, E, W, X can be customized to fit your requirements
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Semiconductor
wafers are routinely thinned prior to dicing to aid the sawing
operation and to allow the final assembled package thickness to be
minimized. For semiconductor devices required to operate at high
power levels, wafer thinning improves the ability to dissipate heat
by lowering the thermal resistance of die. As final thickness is
decreased, the wafer progressively becomes less able to support its
own weight and to resist the stresses generated by post backgrinding
processes. Thus, it is important to reduce the damage caused by
backgrinding. |
UKAM
Industrial Superhard Tools has the technology and expertise to help you
optimize your backgrinding process to ultimate level of efficiency.
UNDER
CONSTRUCTION
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DICING
BLADES |
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DICING
SOLUTIONS
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| DICING
BLADE GUIDE |
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