SMART CUT® 1A1
DIAMOND & CBN WHEELS

  • Applications: Flute Grinding, Surface Grinding, OD Grinding, Knife Grinding, Profile Grinding, Centerless Grinding, Sharpening & Finishing Carbide Tools, Machining Conical, Cylindrical & Flat Surfaces & Conical Apertures
  • Bond Availability: Resin Bond, Sintered (Metal Bond), Hybrid Bond, Nickel Bond (Plated), Braised Bond, Vitrified Bond
  • Available in: Diamond, CBN
  • Size Availability: 1″ (25.4mm) – 27″ (685mm)Diamond Sizes:
  • Standard Lead Times: 4 to 5 weeks.
  • Expedited lead time of 1to 2 weeks is also available at additional cost
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Features

Benefits

Its What You Cant See That Makes All The Difference

SMART CUT® technology

How SMART CUT® Bond Works?

Step 1

Sharpest And Finest Quality Diamonds

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT®  Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 2

Diamonds or CBN Crystals

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT® Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

Step 3

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

Better Cut Quality

& Less Material Deformation

Diamond & CBN tools with SMART CUT® technology make any work much faster & easier, Thousands of sharp and high quality diamond or CBN particles oriented and evenly distributed on both matrix, allow most jobs to be completed by applying little or only moderate amount of pressure even on the most toughest and challenging materials. Freeing the user from constantly having to dress and renew the diamond layer.

SMART CUT® 1A1 DIAMOND & CBN WHEELS
No Glazing

Diamond & CBN tools with SMART CUT® technology require minimum dressing, the bond renews itself.

More Consistent Performance

Diamond & CBN Wheels are produced using only the highest quality raw materials are used in manufacturing process. Utilizing world class quality control, inspection, and measurement equipment. Highly Experienced Engineers constantly monitor and control all material input & output at all stages of manufacturing process. Insuring product consistency for use in demanding & sensitive applications SMART CUT® DIAMOND & CBN wear evenly, and are known for their consistency. You will get consistent cutting speed, and overall consistent performance, with minimum amount of dressing.

Faster Cutting Action

Diamond & CBN tools made utilizing SMART CUT® technology are much more aggressive than your conventional tools. They can cut faster, while still leaving behind a smooth finish free of material deformation.

SMART CUT® 1A1 DIAMOND & CBN WHEELS
Longer Life

In most cases tools manufactured utilizing SMART CUT® technology, will outlast other conventional material (sintered), resin, and nickel bonded diamond & CBN tools. SMART CUT® diamond & CBN tools are more sturdy than tools manufactured with conventional technologies. They are capable to retain their form and bond configuration all the way through the tools life.

Best Performance & Value on the Market​

SMART CUT® Diamond & CBN Wheels are the best investment you can make! Although we may not always be the lowest cost solution provider. Our Diamond & CBN wheels can provide the best ROI. Designed for users that understand and appreciate quality. They will more than pay for themselves in terms of overall performance and provide best Return on Investment.

Manufactured Using The Highest Quality Raw Materials

Only the highest quality synthetic diamonds and raw materials are used in the manufacturing process. The highest quality standards and product consistency is maintained, using sophisticated inspection and measurement equipment.

Why Choose Us?

Optimize your application to ultimate level of efficiency

Diamond & CBN Wheel
Selection Variables

Diamond Concentration

The concentration of diamond or cubic boron nitride (CBN) in grinding wheels significantly influences both the wheel's lifespan and its effectiveness in grinding. Typically, a higher concentration of these abrasives is recommended for softer, more abrasive materials to enhance the durability of the wheel by spreading the wear across more abrasive particles. This setup, however, may reduce the grinding speed due to the increased friction from the many cutting points involved.

Wheels with a lower concentration of diamonds or CBN are best suited for grinding ultra-hard and brittle materials, such as ceramics and glass. With fewer abrasive particles, each one exerts more force, leading to a precise material removal process through micro-fractures. This approach helps to minimize wheel wear while efficiently grinding hard materials.

Conversely, for grinding softer or less brittle materials like metals, plastics, and polymers, wheels with a high concentration of diamonds or CBN are preferred. These wheels operate by plowing through the material with a dense array of abrasive particles, causing work-hardened strips to become brittle and break away. The large number of abrasives not only speeds up the grinding process but also reduces the force each particle exerts, helping to prevent deep deformation in metals.

Selecting the right concentration of diamond or CBN in grinding wheels depends on the material properties and specific grinding requirements. High concentrations generally yield faster material removal on softer materials, whereas lower concentrations are crucial for detailed and precise grinding of hard and brittle materials.

Diamond & CBN Wheel Thickness

The thickness of diamond and CBN (Cubic Boron Nitride) grinding wheels varies widely to suit different applications and material processing needs. For precision grinding tasks, wheels are typically thinner, ranging from about 0.5 mm to 10 mm, allowing for meticulous and detailed material removal. Cut-off wheels, used primarily for slicing through materials, tend to be even thinner, with thicknesses from 0.1 mm to 3 mm to facilitate precise cuts. Conversely, surface and tool grinding wheels, which are used for more extensive surface grinding, generally have thicknesses from 3 mm to 40 mm. For heavy-duty grinding operations involving large workpieces or substantial material removal, wheel thickness can be significantly greater, often from 10 mm up to 100 mm or more.

The thickness of a diamond or CBN grinding wheel directly impacts its grinding performance. Thicker wheels facilitate higher material removal rates, making them suitable for heavy-duty grinding tasks but tend to generate more heat and require more power. Thinner wheels excel in precision grinding tasks due to their ability to produce finer finishes and more detailed work. They also dissipate heat more effectively, minimizing thermal damage to both the wheel and the workpiece.

Stability increases with wheel thickness; thicker wheels resist bending under pressure, thereby enhancing their lifespan and ensuring consistent performance. However, they may require multiple dressings over their lifespan to maintain effectiveness. Thinner wheels, while more flexible for precision work, wear out quicker as they contain less material for dressing. .

Feed Rates

Feed rates in diamond and CBN grinding wheels are essential for achieving optimal grinding performance, balancing material removal, surface finish, and wheel life. The rate at which the workpiece is fed into the wheel depends on factors such as material hardness, wheel type, depth of cut, and the desired surface finish. Harder materials require slower feed rates to prevent damage and excessive wheel wear, while softer materials can tolerate higher feed rates. Deeper cuts also necessitate slower feed rates to avoid overloading the wheel.

Faster feed rates increase productivity but may sacrifice surface finish and reduce wheel life, while slower feed rates provide better control, finer finishes, and longer wheel life. Properly balancing the feed rate based on the material and grinding conditions ensures efficient grinding, quality results, and longer-lasting wheels. Adjusting the feed rate to match the needs of the specific task is key to optimizing performance and prolonging the life of diamond and CBN grinding wheels.

Diamond & CBN Wheel Speeds/RPM’s

The RPM (Revolutions Per Minute) of diamond and CBN grinding wheels plays a key role in determining grinding performance. Harder materials like ceramics and hardened steel typically require lower RPMs to prevent overheating and excessive wear, while softer materials can be ground at higher RPMs. Larger wheels, due to their size, should run at lower speeds compared to smaller wheels, which can handle higher RPMs.

For fine precision and smooth surface finishes, lower RPMs are ideal, providing better control and reducing the risk of surface damage. Higher RPMs can be used for faster material removal but require careful attention to heat generation and wheel wear. Excessive RPMs can cause overheating, damaging both the wheel and the workpiece, particularly with heat-sensitive materials.

In general, diamond and CBN wheels operate effectively within a range of 3,000 to 6,000 RPM, depending on the material and wheel size. Adhering to optimal RPMs ensures efficient grinding, longer wheel life, and better overall results.

Diamond Particle/Grit size

In diamond and CBN grinding wheels, the particle or grit size profoundly influences several aspects of the wheel's performance. Coarser grits enable faster material removal rates due to their aggressive cutting action, which is beneficial for increasing productivity in scenarios where high grinding speeds are necessary. Conversely, finer grit sizes produce a smoother finish, as the smaller particles make less aggressive cuts, reducing surface roughness. This is crucial for applications that demand a high-quality finish.

The amount of chipping during grinding is also impacted by the grit size. Finer grits typically result in less chipping, making them suitable for grinding brittle materials or when precise, clean edges are essential. However, coarser grits might cause more significant damage to the material’s microstructure because of their aggressive nature, which could be problematic in precision engineering applications where the integrity of the material is critical.

Selecting the appropriate grit size is vital for optimizing both the material removal rates and the quality of the finished surfaces. Coarse grits are preferred for rapid material removal when finish quality is less critical, while finer grits are ideal for achieving high-quality finishes and minimizing damage, particularly in delicate or precise grinding tasks.

Bond Hardness

For diamond and CBN grinding wheels, the hardness of the bond matrix is crucial in determining how effectively the diamonds or CBN particles are held in place. As the hardness of the bond increases, so does its capability to retain these abrasive particles, which can extend the life of the grinding wheel. However, a harder bond typically results in a slower grinding speed.

Grinding wheels are categorized based on the hardness of their bonds, ranging from Soft, Medium, to Hard, with numerous variations and classifications within these categories to suit different materials and applications..

Selecting the optimal bond hardness for your specific application is essential for achieving efficient and precise grinding results. A bond that is too soft for the material being ground tends to release the abrasive particles too quickly. This premature release can lead to faster wear and a reduced lifespan of the grinding wheel. Conversely, a bond that is too hard can impede the grinding speed, .

necessitating frequent dressing of the wheel to expose new layers of abrasive particles. As a general guideline, harder materials such as sapphire and alumina benefit from grinding wheels with softer bonds, which allow for more aggressive material removal without compromising the integrity of the wheel. Softer or more brittle materials, on the other hand, are better matched with harder bonds, which help prevent excessive wear and maintain the wheel's effectiveness over time.

Diamond & CBN Outside Diameter

These diameters are carefully chosen based on the specific needs of the application, the properties of the material being cut, and the capabilities of the cutting machine. Resin diamond cut off blades & cutoff wheels, which are available in sizes ranging from 1 inch to 20 inches in diameter, offer varied capabilities based on their size. The diameter of the blade should be chosen with consideration to the diameter and thickness of the material being cut. Smaller diameter blades, which tend to be thinner, are more susceptible to bending and warping during use. On the other hand, larger diameter blades, being thicker, provide greater stability and are typically employed for cutting larger and heavier materials. These larger blades can handle higher loads and speeds, making them suitable for more demanding cutting tasks.

Diamond & CBN Bond Type

Diamond and CBN grinding wheels are available with various bond types, each suited for specific grinding applications.
Resin Bond wheels are popular for tool, cutter, and precision grinding due to their self-sharpening properties and fast cutting speeds. They offer a balance between material removal, wheel life, and finish.

Metal Bond wheels provide durability and long life, excelling in high-precision applications like grinding hard materials (e.g., ceramics, glass, hardened steels). Though slower cutting, they are highly wear-resistant.

Vitrified Bond wheels are rigid and heat-resistant, ideal for high-speed grinding. Their porous structure aids in chip clearance and cooler operation, making them perfect for precision grinding.

Electroplated Bond wheels feature a single layer of abrasives bonded with nickel, maintaining excellent form stability. They are used for precise profile grinding but have a shorter lifespan.

Hybrid Bonds combine resin, metal, or vitrified components to balance cutting efficiency, finish, and wheel life, making them suitable for demanding grinding tasks.

Selecting the appropriate bond type ensures optimal performance, finish quality, and wheel longevity for specific materials and grinding operations.

Diamond & CBN Wheel
Selection Variables

Concentration for Diamond & CBN blades

Diamond Concentration

Diamond Concentration – Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.

Low Diamond Concentration - typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.

High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Diamond & CBN Kerf Thickness

Blade Thickness

Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning

For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory. .

Grit Sizes for Diamond & CBN Blades

Diamond Particle/Grit size

Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain. Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended.

Bond Type

Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Blade Outside Diameter

Blade Outside Diameter

typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades

Feed Rates

load/feed rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Diamond & CBN Blade Bond Hardness

Bond Hardness

Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness.

Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Diamond & CBN Blade RPM’s

Blade Speeds/RPM’s

Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

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