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SMART CUT™ Precision Diamond & CBN Wafering Blades are designed and specially selected to provide the maximum possible blade life for your desired cut quality, and speed.

Save up to 650%. BUY DIRECT & SAVE

Why Pay More?

We will beat any competitors prices quote for same quality product.

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Diamond Depth / Height on all wafering blades below is 4mm (.157")

Testimonials (see what others are saying)

Diamond & CBN Wafering Blades (Laboratory Grade)


SMART CUT™ Precision New Generation Sintered (metal bonded) Diamond & CBN Wafering Blades are the highest overall performance blades available today. Designed specifically for Sample Preparation & Materials Research. Manufactured utilizing SMART CUT technology, giving you consistent results you can count on everyday. Wafering Blades are available from inventory in many different diamond concentrations, mesh sizes, bond hardness, & inside diameters. Available from stock for any manufacturers low or high speed sectioning/wafering saw. We will work with you to determine your needs, and recommend the right parameters for your specific material/application. Compare to any other brand name Diamond Wafering Blades such as: BUEHLER, STRUERS, LECO & Many Others. If you are not using these blades, you are paying too much & missing out on incredible performance.  


Diamond wafering blades are available with large variety of diamond mesh / particle sizes using a scale from 5 (finest) to 30 (coarsest). A diamond wafering blade with number 10 will have larger diamond particles than wafering blade with rating of No. 5. yet they are not necessarily twice as large. A general rule of thumb is the smaller the diamond particles/crystals the lower the resulting deformation. However this is not always the case and depends on material being sectioned. A number of materials require larger diamond particle size to be cut effectively and economically. Using smaller size diamonds would not be economical and create large material deformation.

   =  2.2 times  MORE  life 

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  • Reduce & Eliminate additional steps often required after sectioning

  • Preserve True Material Microstructure (no deformation)

  • Excellent Performance, even on Materials with a High Metallic Content

  • Works on larger variety of materials (More Universal)

  • No Smearing / No Material Deformation

  • Section Hard to machine materials 3 times faster

  • Longer Life (Last 2.2 times longer

  • Priced 3 times less expensive than the leading / conventional Brand Name Wafering Blades

  • Non Magnetic Alloy Core 

  • No Contamination

  • Can be used with plain water, synthetic coolant, or oil

  • Easy to Use / Minimal Dressing


Below is a Item Number cross reference chart of Sintered (Metal Bond) Laboratory Grade Diamond Wafering Blades, for several diamond wafeirng blade vendors. Such as BUEHLER, STRUERS, & LECO. Use this table to cross reference the Item Number of the Existing / Conventonal Diamond Wafering Blade you may have been using to the New Generation, sintered (metal bond) Diamond Wafeing Blade with SMART CUT™ technology manufactured by UKAM Industrial Superhard Tools. 

Contact us to receive immediate quote. START SAVING MONEY TODAY!

Other Sizes and Specifications are also available from inventory - please inquire



Series 30HCU

for soft & gummy materials. Use with plastics, polymers, rubber & etc.

Diameter Thickness BUEHLER Item No. STRUERS Item No. Leo Item No. UKAM Item No.


5" (127mm) .030" (0.76mm) 11-4239



7" (178mm) .030" (0.76mm) 11-4241 ------ ------ 23-4871ME REQUEST QUOTE
8" (203mm) .035" (0.9mm) 11-4242 ------ ------ 23-4872ME REQUEST QUOTE

Series 20HCU

for aggressive general sectioning of metals (ferrous and nonferrous materials including titanium alloys).

Diameter Thickness BUEHLER Item No. STRUERS Item No. Leo Item No. UKAM Item No.


5" (127mm) .020" (0.5mm) 11-4215 456CA 331CA 357CA ------ 23-4873ME REQUEST QUOTE
6" (152mm) .020" (0.5mm) ------ 356CA 370CA 459CA 457CA 45UCA ------ 23-4874ME REQUEST QUOTE
7" (178mm) .025" (0.6mm) 11-4237 ------ ------ 23-4875ME REQUEST QUOTE
8" (203mm) .035" (0.9mm) 11-4238 655CA 659CA 657CA ------ 23-4876ME REQUEST QUOTE

Series 15HCU

For general use with ferrous and nonferrous alloys, copper, aluminum, metal matrix, composites, PC boards, thermal spray coatings, and titanium alloys

Diameter Thickness BUEHLER Item No. STRUERS Item No. Leo Item No. UKAM Item No.


3" (76mm) .006" (0.15mm) 11-10066


121CA, M0D08, 40000041 ------


3" (76mm) .012" (0.3mm) ------ 100CA ------ 23-4877ME REQUEST QUOTE
4" (101.1mm) .012" (0.3mm) 11-4244 230CA, M0D10, 40000043 801-137 23-4878ME REQUEST QUOTE
5" (127mm) .015" (0.4mm) 11-4245 330CA 355CA 357CA, M0D13, 40000038 802-439 23-4879ME REQUEST QUOTE
6" (152mm) .020" (0.5mm) 11-4246 430CA 459CA, M0D15, 4000054 ------ 23-4880ME REQUEST QUOTE
7" (178mm) .025" (0.6mm) 11-4247 M4D18, 40000046 ------ 23-4881ME REQUEST QUOTE
8" (203mm) .035" (0.9mm) 11-4248

657CA, M020, 40000084

------ 23-4882ME REQUEST QUOTE

Series 20LCU 

for use with hard/tough materials structural ceramics, boron carbide, boron nitride, and silicon carbides

Diameter Thickness BUEHLER Item No. STRUERS Item No. Leo Item No. UKAM Item No.


4" (101.1mm) .012" (0.3mm) ------ 452CA ------ 23-4883ME REQUEST QUOTE
5" (127mm) .020" (0.5mm) 11-4225 352CA ------ 23-4884ME REQUEST QUOTE
7" (178mm) .025" (0.6mm) 11-4227 ------ 23-4885ME REQUEST QUOTE
8" (203mm) .035" (0.9mm) 11-4228 652CA ------ 23-4886ME REQUEST QUOTE

Series 15LCU

for use with hard/brittle materials such as Glass, Al203, Zr203, Concrete, & many others

Diameter Thickness BUEHLER Item No. STRUERS Item No. Leo Item No. UKAM Item No.


3" (76mm) .006" (0.15mm) 11-10067


M1D08, 40000069 ------ 24-4887ME REQUEST QUOTE
3" (76mm) .010" (.25mm) ------ 100CA ------ 23-4887ME REQUEST QUOTE
4" (101.1mm) .012" (0.3mm) 11-4254 230CA, M1D10, 40000070 801-137 23-4888ME REQUEST QUOTE
5" (127mm) .015" (0.4mm) 11-4255 330CA, M1D13, 40000071 802-439 23-4889ME REQUEST QUOTE
6" (152mm) .020" (0.5mm) 11-4276 430CA, M1D15, 40000068 ------ 23-4890ME REQUEST QUOTE
7" (178mm) .025" (0.6mm) 11-4277 ------ ------ 23-4891ME REQUEST QUOTE
8" (203mm) .035" (0.9mm) 11-4279 M1D20, 40000072 ------ 23-4892ME REQUEST QUOTE

Series 10LCU

for use with medium to soft ceramics, electronic packages, unmounted integrated circuits, GaAs, AIN and glass fiber reinforced composites

Diameter Thickness BUEHLER Item No. STRUERS Item No. Leo Item No. UKAM Item No.


3" (76mm) .006" (0.15mm) 11-10068





3" (76mm) .012" (0.3mm) ------ ------ ------ 23-4891ME REQUEST QUOTE
5" (127mm) .015" (0.4mm) 11-4285 ------ ------ 23-4892ME REQUEST QUOTE
7" (178mm) .025" (0.6mm) 11-4287 ------ ------ 23-4893ME REQUEST QUOTE
8" (203mm) .035" (0.9mm) 11-4288 ------ ------ 23-4894ME REQUEST QUOTE

Series 5LCU

for use with soft friable ceramics, electronic packages, unmounted integrated circuits, composites with fine reinforcing media, CaF2, MgF2, and carbon composites

Diameter Thickness BUEHLER Item No. STRUERS Item No. Leo Item No. UKAM Item No.


3" (76mm) .006" (0.15mm) 11-10069


------ ------ 24-4895ME REQUEST QUOTE
3" (76mm) .012" (.3mm) ------ ------ ------ 23-4895ME REQUEST QUOTE
5" (127mm) .015" (0.4mm) 11-4295 ------ ------ 23-4896ME REQUEST QUOTE



CBN is recommended for cutting had metals, specially iron and steel. Since carbon in steel reacts with carbon in diamond, quickly dulling the diamond crystal and slowing the material removal. CBN blades provide significantly reduced cutting times for tough, gummy materials, such as lead and titanium. However, CBN are not recommended for ceramics and other non metallic materials.These blades will provide precise cutting capability on difficult to cut samples/materials. These CBN blades will significantly reduce your cutting time on ferrous materials compared to conventional diamond wafering blades. 


For iron, carbon steels, high alloy steels, cobalt alloys, nickel superalloys, and lead alloys

Diameter Thickness BUEHLER Item No. STRUERS Item No. Leo Item No. UKAM Item No.


3" (76mm) .006" (0.15mm) 11-10070



------ ------


3" (76mm) .012" (0.3mm) ------ ------ ------ 23-4897ME REQUEST QUOTE
4" (101.1mm) .012" (0.3mm) 11-4264


235CA ------ 23-4898ME REQUEST QUOTE
5" (127mm) .015" (0.4mm) 11-4265


355CA ------ 23-4899ME REQUEST QUOTE
6" (152mm) .020" (0.5mm) 11-4266


455CA ------ 23-4900ME REQUEST QUOTE
7" (178mm) .025" (0.6mm) 11-4267


------ ------ 23-4901ME REQUEST QUOTE
8" (203mm) .035" (0.9mm) 11-4268


655CA ------ 23-4902ME REQUEST QUOTE


8" x .035" x 1/2"















available in different diamond

concentrations & mesh sizes

10" x .040" x 1/2", 5/8",  1", 1.25" ID











available in different diamond

concentrations & mesh sizes

12" x .051" x 1/2", 5/8",  3/4", 1", 1.25" ID








available in different diamond

concentrations & mesh sizes

All sizes are in stock and ready for same day delivery.

Other sizes are available upon request. Please check for availability.

Arbor Sizes (ID): 1/2", 5/8", 1", 1-1/4", 32mm. We can make any arbor size you want.

100% Quality is Guaranteed

  What you Should Know Before you Buy your Next Diamond Wafering Blade (3,409kb )

  Sintered Diamond Wafering Blades (889kb) 

  Hybrid Bond Diamond Wafering Blades (881kb)







Selecting Right Wafering Blade

Wafering Blade Usage Recommendations

Wafering Blade Case Studies

Customer Testimonials

Optimizing your Cutting Operation

Trouble Shooting Wafering Blade Problem

Getting the Most from your Diamond Tools

Diamond Wafering / Sectioning Blade by itself is perhaps the most important factor in your sectioning / precision diamond sawing operation.

The diamonds impregnated inside the bond matrix of the wafering blade, are what actually participate in cutting action. No matter how precision or well made your wafering saw. You will not be able to obtain the material surface finish, and precision tolerances you need, if the blade you are using is not right for your application. UKAM Industrial Superhard Tools proprietary blade chemistry, precision manufacturing methods, modern quality control methods, allow us to control and regulate the dozens of variables that affect blade life, quality of cut, surface finish. Reducing and often eliminating additional steps often required after sectioning. All blades are manufactured and available from inventory to fit your specific material, application, and surface finish requirements. We will work with you to determine your needs, and develop the right bond formulation, concentration, and grit sizes. SMART CUT ™Precision Diamond Wafering Blades are designed and specially selected to provide maximum possible blade life, for your desired cut quality and speed.

UKAM Industrial Superhard Tools is one of the Leading Diamond Wafering Blade Manufacturers, with one of the Largest Inventory of Precision Diamond Wafering Blades in the U.S. Over 20,000 diamond wafering blades in stock, available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness's.

You are sure to find the Right Diamond Wafering Blade for your application in stock and ready for same day delivery. If you are not using these blades, you are paying too much.


Most diamond & CBN Wafering Blade Users already know which blade to use for their application. This information is typically based on the blade item number already used or recommendation provided by saw manufacturer or consumables supplier. Blade specification is identified by item number for fast and easy reordering. Some obtain this information through literature or recommendation given by their customer support representative. Although the blade you are using now may be working satisfactory. Do you really know if it is the best solution to your needs?

Many clients waste valuable time & money by using incorrect blade for their application. Some use blade with too fine size diamond particles, causing excessively long cutting times and material burning. Some use to thin of a blade for their material diameter/shape and prematurely bend, damage, or chip the diamond section. Most consumable vendors do not spend the time to educate the user on the wide variety of blade specifications and options available today. Nor provide the full blade specification per ANSI (American National Standards Institute) diamond & CBN blade labeling standards. 

UKAM Industrial Superhard Tools specializes in manufacturing Diamond & CBN wafering & cut off blades for large variety of industries & applications (not just for laboratory / sample preparation) use. We have in stock over 20,000 diamond & CBN blades in wide variety of different specifications (not just specifications indicated above). We understand that your success depends on select the right tools & consumables, and optimizing them to best fit your needs. We believe that the best client is a well-informed client. The more you understand about what we can do for you, the better our partnership will be. On our web site you will find the Most Comprehensive Source of Information on Everything you wanted to know diamond & cbn wafering blades, cutting, grinding, & polishing. We are focused on your long term success and take great pride in helping you grow and prosper.

Diamond Concentration – Diamond Concentration is still a factor in determining the life and cutting speed of your Diamond Sectioning/Wafering Blade. Higher diamond concentration is recommended and usually used for cutting softer and more abrasive types of materials. However, the trade off is significantly slower cutting speed. Low diamond concentration is recommended and widely used for cutting ultra hard and brittle materials.  

Low Diamond Concentration - typically low concentration wafering blades should be for cutting ultra hard and brittle materials such as ceramics and glass. In Low Concentration Wafering Blades, diamond works by fracture process. Pressure on each diamond crystal/particle is higher which provides enough stress to chip off small flakes in the cut.

High Diamond Concentration - High concentration diamond wafering blades are recommended for cutting metals, plastics and polymers. In this application, materials cut by a plowing mechanism. In this applications diamond plough through the material, work hardened strips of materials become brittle and break off. The greater number of diamond by volume, the quicker the cutting action will be. Increasing the number of diamond s also lowers the per unit force. For metals where it is possible to induce deep deformation layers, a lower per unit force is desirable to reduce the deformation during the cut.

Diamond & CBN Particle size -  Diamond Mesh Size plays a major role in determining your cutting speed, cut quality/surface finish, level of chipping you will obtain, and material microstructure damage you will obtain.  Diamond Mesh size does have considerable effect on cutting speed. Coarse Diamonds are larger than finer diamonds and will cut faster. However, the tradeoff is increase in material micro damage. If you are cutting fragile, more delicate materials then finer mesh size diamond wafering blades are recommended. 

Blade Thickness – Wafering blade thickness typically ranges from .006” to .040” (1mm). Thinner and thicker wafering blade are available, frequently from stock upon request. Kef thickness  typically increases with blade diameter (in proportion to diameter of the blade). Kerf is the amount of material removed from the material/sample due to the thickness of blade passing though the material/sample. Blade thickness is important for users requiring most minimal amount of material loss during sectioning.

 For example if the user requires precision position of the cutting plane relative to the detail on the sample (IC circuit for example), a thinner and smaller diameter blade would be best for this application. Blades ranging from 3” to 5” (75mm to 125mm) in diameter and thickness .006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose. There are large variety of factors that will contribute to optimal blade thickness for your material/application Including your desired cutting speed, load/feed rate, material diameter, thickness, hardness, density, and shape. As well as skill & experience of the operator. Thicker wafering blades are more stiff and can whistand higher loads/feed rates. Another advantage of thicker kerf blades is they are more forgiving to operator error and abuse. Thicker kerf blade are recommended for use in environment where large number of individuals will be sharing and using same equipment. Perfect for less experienced and novice saw operators, such as in University laboratory.

Blade Diameter – typically wafering blade diameters range form 3” (75mm) to 8” (200mm). Wafering blade diameter should be selected based on material diameter and thickness being cut. Smaller diameter wafering blades are thinner than the larger diameter blades and are more prone to bending and warping. Although large diameter blades are thicker, they are typically used for cutting larger and heavier samples at higher loads and speeds than smaller blades


Bond Hardness – Ability of the bond matrix to hold diamonds. As the hardness of the bond is increased, its diamond retention capabilities increase as well. However the trade off is slower cutting speed. Life of the diamond blade is usually increased with hardness of its bond matrix. Bonds are designated on their scale of hardness from Soft, Medium, and Hard. There are dozens of variations and classification schemes based on bond degree of hardness or softness.

 Using diamond blades with optimum bond hardness for your application is important to successful precision diamond sawing operation. Bond matrix that is too soft for the material being cut will release diamond particles faster than needed, resulting in faster wear and shorter diamond blade life. On other hand bond matrix that is too hard will result in much slower cutting speeds and require constant dressing to expose the next diamond layer. As rule of thumb, harder materials such as sapphire and alumina generally require a softer bond. Whereas softer and more brittle materials require a harder bond.

Bond Type - Metal bonding offers long life and durability, while resin bonding creates less heat, provides better surface finish and is well suited for cutting hard, delicate or brittle materials.

Loads/Feed Rates – load/feed rate applied to wafering blades typically vary from 10-1000 grams. Generally, harder specimens are cut at higher loads and speeds (e.g. ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g. electronic silicon substrates). The Speeds/RPM’s you are using, shape/geometry of the specimen, and how the specimen is being clamped/hold in place will affect the load that can be used for your application.

Wafering Blade Speeds/RPM’s - Most wafering blades are used between 50 to 6,000 RPM’s Typically harder and more denser materials such as Silicon Carbide, are cut at higher RPM’s/speeds Where more brittle materials such as silicon wafers and gallium arsenide are cutting at lower RPM’s. Low Speed saws RPM’s are typically limited from 0 to 600 RPM’s. Where high speed saws offer much large variety of cutting speeds from 0 to 6,000 RPM’s.

Examples of cutting times for Sectioning of Specific Materials 0.25" (6.4mm) diameter rod. Using various cutting speeds.

Material Blade Type Diamond Concentration Speed (RPM's) Load (grams) Estimated Cutting Time
Hot Pressed Silicon Nitride Si3N4 Series 20LCU Low 4,000 800 0:30
Boron Carbide B4C Series 20LCU Low 3,500 700 0:15
Sapphire Al203 Series 15LCU Low 1,500 300 0:40
Chromium Doped Sapphire Al203 Series 15LCU Low 500 500 0:20
Partially stabilized Zirconia ZrO2 Series 15LCu Low 2,500 500 0:38
Silicon Carbide, SiC Series 15LCU Low 2,500 500 0:16
Case Hardened Steel Series 15HCU High 2,500 500 0:16
Grey Cast Iron Series 15HCU High 2,500 500 0:25
Titanium Alloy Series 15HCU High 2,500 500 0:32
Zinc Alloy Series 15HCU High 2,500 800 0:15
Tungsten Carbide 6% cobalt binder, wC Series 15HCU High 4,500 900 0:15
Tungsten Carbide 25% cobalt binder, WC Series 15HCU High 1,500 300 1:55
High Purity fused silica SiO2 Series 15HCU High 2,500 500 0:40
Extruded Alumina, Al203 Series 15HCU High 3,000 600 0:40
Aluminum Nitride AIN Series 15HCU High 1,500 300 0:30
Nickel Zinc Ferrite Series 15HCU High 1,500 300 0:30
Manganese Zinc Ferrite Series 15HCU High 2,500 5,000 0:30
Yttrium aluminum garnet, YAG Series 15HCU High 3,000 600 1:15
8 micron graphite fiber reinforced zirconium diboride/molybenum disilicide composite Series 15HCU Low 2,500 300 0:20
White Cast Iron Series Metacut CBN High 2,500 700  
Thermal Spray Coatings Series 15HCU High 3,000 700  

SMART CUT™ Precision Diamond Saws


For R & D and Manufacturing Organizations on a Budget

UKAM Industrial produces complete range of Sectioning Saws and Accessories for sample preparation (sectioning) of advanced materials, ultra hard & brittle materials, optics, composites, metals and etc. Typical applications include materials such as: ceramics, glass, plastics, quartz, metals, and graphite. Most samples / materials can be sectioned in seconds or few minutes with no material deformation. Preserving true sample / material micro structure. Providing equal Precision, Productivity and Versatility as High Cost Fully Automatic Diamond Wafering Saws, at a small fraction of the price.  Find out more >>>

Used for: R & D, Quality Control, Failure Analysis, Production

What you should know before you buy your next diamond blade?




SMART CUT™ Precision Diamond Saws

Used for: R & D, Quality Control, Failure Analysis, High Production

Diamond Wafering Blades News Release


In 1998 UKAM Industrial Superhard Tools,  Division of LEL Diamond Tools International, Inc.  introduced  SMART CUT  technology,  a  new  breakthrough in  manufacturing precision diamond wafering blades. The  company  maintains  this  technology  will  redefine  the  standard  in  cutting.

This  technology  allows  us  to  properly  position  and  orient  the  diamond  inside  the  metal  matrix. Making  sure  every  diamond  is  in  the  right  place  and  at  the  right  time,  working  where  you  need  it  most. 

 This technology has also allowed us to develop a  NEW GENERATION HYBRID BOND  diamond bond matrix. In  a  SMART CUT™  diamond  bond  you  will  find all  the  advantages  of  cutting  speed  and  smoothness  that  you  have  come  to  expect  in  a  resin  bond,  and  unique  characteristics of a metal bond in terms of life, aggressiveness,  durability,  and  excellent  performance  on  you  look  for  in  a  metal  bond.

 maximum cutting performance – each  diamond  works  like  a  small  horse. Diamonds  come  in  contact  with  the  material  in  the  right  place  and  at  the  right  time,  working  where  you  need  them  most. You  get  the  maximum  use  out  of  diamond  and  bond.

 no glazing – blade requires minimum dressing, the bond renews itself. Compare to conventional diamond wafering blades that frequently require repeated dressing.

 faster cutting/sectioning action - Diamond wafering blades manufactured utilizing this technology are much more aggressive than your conventional blades. Section ultra hard materials, advanced materials, brittle materials, optical materials, metals, & semi conductor materials up to 3 times faster. While still preserving material true micro structure & leaving behind a smooth surface finish. 

more universal - SMART CUT Diamond Wafering Blades are designed to work on practically any material you can find, You can cut very hard materials, than switch to cutting soft materials and the blade will still maintain the same consistent performance.

superior coolant system - these blades are designed to cut with or without oil. We feel it is more preferable to the user to use water as a coolant. Oil does not a proper coolant for this procedure, as most other manufacturers would suggest. Water is a true organic coolant, witch does not leave the specimen being cut oily or contaminated.

More sturdy alloy coreSMART CUT Diamond Wafering Blades are made with  very durable proprietary alloy steel or non-magnetic core. Designed to withstand heavy use and exploitation in a wide variety of difficult  environments and materials. You can expect less blade wreckage and blade walking, due to loss of wafering blade core tension.

 UKAM Industrial Superhard Tools – TEAM  

UKAM Industrial Superhard Tools  Division of LEL Diamond Tools International, Inc.

28231 Avenue Crocker, Unit 80  Valencia, CA 91355  Phone: (661) 257-2288  Fax: (661) 257-3833

e-mail: lel@ukam.com

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