Diamond Dicing Blades

Diamond & CBN Dicing Blades

SMART CUT ® technology

Dicing Blades from 0.5" (12.7mm) to 6" (154mm) in Diameter, starting from .001" (25 microns) Thick For all applications and all types of Dicing & Slicing machines

When it comes to dicing, there is only one company that stands out. UKAM Industrial Superhard Tools is a one of the leading precision U.S. diamond dicing blade & tool manufacturers. As the first company to develop SMART CUT™ technology, UKAM Industrial is a Partner in Your Success. We have the Experience, Tradition, and the People to improve & optimize your dicing operation. Contact us for Free Quote & application recommendation today!

Metal Bond (Sintered) Dicing Blades

Excellent form holding & corner characteristics, provide very long life, high level of consistency. Recommended for users requiring very straight cuts and larger blade exposures.

Hybrid Bond™ Dicing Blades

You will find all the advantages of cutting speed and fine finish that you have come to expect in a resin bond, and long life, consistency, aggressiveness, durability, and excellent performance on you look for in a metal bond.

Nickel Bond (Hubless) Dicing Blades

Capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials.

Resin Dicing Blades

More forgiving, self dressing, and freer cutting. Excellent choice for Ultra Hard & Brittle Materials. Recommended for applications where cut quality and surface finish is very important.

Nickel Bond (Hubbed) Dicing Blades

Typically used for dicing silicon and III-V materials. Creates very thin kerfs, 50 microns. Providing excellent cut quality with low wear rate

Carbide Dicing Blades

Slitting magnetic tape for computer backup applications, metal foils, P.E.T., polyester, sheet rubber, fine gauge steel, film, abrasive paper products, PC Board substrates, fiberglass, laminates, MLP/QFN

Dicing Equipment

Dicing

Table Top Slicing & Dicing Saw

Designed for Laboratory and R & D use. This machine can be used for slicing, dicing or cutting all kinds

Dicing

Accessories & Consumables

SMART CUT® Dicing Coolant (Water Soluble)

SMART CUT Synthetic Water Soluble coolant (fully contamination free) will reduce heat & friction between dicing blade and material. And improve

Dicing Service & Process Development

On all types of Metallic Materials, Ceramics, Optics, Substrates & Wafers. Typical Dimensions of material we work with: Maximum Size of

Why use Coolants?

Dressing Sticks

We offer large range of dressing stick specifications in wide range of sizes and shapes for most dicing blade applications.

Flanges​

We produce and offer large variety of dicing blade flange specifications to fit most dicing blades.

How To Select The Right Diamond Dicing Blade

For Your Application

Dicing Blade Bond Types
Resin
Sintered
(Metal Bond)
Hybrid
BondTM
Nickel Bond (Hubless)
Nickel Bond (Hubbed)
Bond Illustration
Sem Image
Description:

Organic bond matrix that is formed by high pressure and high temperature

Metallurgical Bond with multiple ayers of diamonds impregnated inside the metal matrix.

Organic bond matrix that is formed by high pressure and high temperature

Halvanic process, where diamond is deposited on steel body in chemical solution by time.

Galvanic process, where diamond is deposited on steel body in chemical solution by time.

Dicing Blade Applications
  • Alumina
  • Barium Titanate
  • Garenet
  • Glass & Quartz
  • Ferrite
  • LiNb03
  • Silicon
  • Fused Silica
  • Electronic Ceramics
  • Sapphire
  • FR4/BT Resin
  • Alumina
  • Glass
  • Copper & PCB
  • AITIC
  • Green Ceramic
  • Plastic Laminates
  • Zirconia
  • Rare Earth Magnets
  • Fired Multi Layered Ceramics
  • BGA Packages
  • QFN
  • Aluminum oxide (A1203)
  • Silicon nitride (Si3N4)
  • Silicon carbide (SiC)
  • Sapphire Boron Carbide (B4C)
  • Alsmag
  • LiTaO3 & LiNbo
  • FR4 and Resin
  • Green Ceramic
  • Silicon
  • AlTic
  • Optical Glass
  • Optical Fiber Ferrule
  • Metal Oxide
  • PCB
  • Silicon
  • GaAs
  • Sapphire
  • SIC
Dicing Blade Characteristics

Resin Bond dicing blade are typically more forgiving. self dressing, and freer cutting. Excellent choice for Ultra Hard & Brittle Materials. Recommended for applications where cut quality and surface finish is very important.

Sintered (metal bond) Dicing blades have excellent form holding & corner characteristics, provide very long life, high level of consistency. Recommended for users requiring very straight cuts and larger blade
exposures.

You will find all the advantages of cutting speed and fine finish that you have come to expect in a resin bond, and long life, consistency, aggressiveness, durability, and excellent performance on you look for in a metal bond.

Nickel Bond dicing blades are available with and without hubs. Capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials.

Nickel Bond Hubbed dicing blades are typically used for dicing silicon and III-V materials. Creates very thin kerfs, <50 microns. Providing excellent cut quality with low wear rate

Adventages
  • Self Dressing
  • Freer Cutting
  • Cuts almost any material
  • Clan cuts on hard and brittle material
  • Any blade thickness is available .003" and up
  • Minimum dressing required
  • Wide variety of bond matrixes and specifications available
  • Lower Cost
  • Longer Life
  • Minimized blade wear
  • high cutting ability
  • Improved blade rigidity
  • Highly accurate blade dimensions
  • Minimal Chipping of Critical Edges
  • Large Variety of Bond Matrixes for all Applications
  • Maximum Cutting Performance
  • No Glazing
  • Faster Cutting Action
  • Improved Surface Finish Better Coolant Retention
  • No Material Deromration
  • No Contamination
  • Very low blade wear
  • Maintains good edge geometry
  • Excellent on applications requiring high accuracy
  • Ultra thin blade thickness are available such .0006" (0.018mm)
  • Very low blade wear
  • Maintains good edge geometry
  • Excellent on applications requiring high accuracy
  • Ultra thin blade thickness are available such .0006" (0.018mm)
Dicing Blade Bonds
  • SC1R
  • SC2R
  • SC3R
  • SC4R
  • SC5R
  • SC6R
  • SC7R
  • SC1M
  • SC2M
  • SC3M
  • SC4M
  • SC5M
  • SC6M
  • SC7M
  • SC1H
  • SC2H
  • SC3H
  • SC4H
  • SC5H
  • SC6H
  • SC7H
  • EZC I
  • EZC II
  • EZC III
  • SNBI
  • SNBII
  • SNBIII
Abrasive (Diamond/CBN) Sizes

3 to 151 micron

3 to 126 micron

3 to 151 micron

3 to 70 micron

2 to 50 micron

Abrasive (Diamond/CBN) Types

Coated & Uncoated Synthetic Diamond or CBN

Natural Diamond, Coated &
Uncoated Synthetic Diamond or CBN

Coated & Uncoated Synthetic Diamond or CBN

Natural & Synthetic Diamond

Natural & Synthetic Diamond

Type of Diamond/CBN Used:

High friability, excellent microfracturing

Cubo-octahedral crystals, semi crystaline crystals

High friability, excellent microfracturing

Medium tough

Medium tough

Example of diamond Crystal Used:
Abrasive Concentration

25 to 200 con

25 to 200 con

25 to 200 con

100 to 250 con

100 to 250 con

Minimum Dicing Blade Thickness

.003" (.076mm)

.004" (0.101mm)

.004" (0.101mm)

0003" (0.0076mm)

.0003" (0.0076mm)

SMART CUT ™ Precision Diamond Dicing Blades are designed and specially selected to provide maximum possible blade life, for your desired cut quality and speed

UKAM Industrial Superhard Tools has over 50 years of experience in Manufacturing, Research & Development of Ultra Thin & High Precision Diamond Dicing Blades for many Industries/Applications. We are a “Partner in Your Success”.

Equipment Used On:

We Can Help You:

ITS WHAT YOU CANT SEE THAT MAKES ALL THE DIFFERENCE

SMART CUT® technology

CBN Crystal

How SMART CUT ® Bond Works?

Step 1

Sharpest And Finest Quality Diamonds

The newly exposed diamonds don’t effect diamonds already working on the material. Unlike many other diamond bonds, diamonds in a SMART CUT ®  Bond remains sharp and grow sharper with each cut, prolonging product life and consistent performance.

Step 2

Diamonds or CBN Crystals

Diamonds or CBN Crystals are activated only at the exposed layer. As Bond Matrix layer begin to wear out, diamonds in a new Bond Matrix layer are immediately activated, substituting the already used up diamond layer. The SMART CUT Diamond Hybrid Bond makes sure every diamond is in the right place and at the right time, working where you need it most.

Step 3

Advanced Formulated Open Diamond Bond Design

This advanced formulated open diamond bond design insures minimal chipping, fast cut, constant speed of cut, minimal cutting noise, and most important of all, consistent performance.

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