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DIAMOND BACKGRINDING WHEELS - SMART CUT SERIES

NEW GENERATION & TECHNOLOGY

Used on backgrinding machines for thinning and flattening silicon wafers, glass products, ceramic products. Sizes range from 8 to 14 O.D. Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others.

Available in large variety of bond such as sintered (metal bond), resin bond, vitrified bond, plated (nickel bond). Specification of diamond backgrinding wheel can be optimized to fit your particular application/material.

Type

Profile sketch

Common Specifications

in mm

Diameter

D

Thickness

T

Inside Diameter

6A 2

175

30-35

76

200

35

76

350

45

127

6A 2T

195

22.5-25

170

280

30

228.6

350

35

235

6A 2T

(three ellipses)

209

22.5-23

158

All Dimensions: T, E, W, X can be customized to fit your requirements

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Semiconductor wafers are routinely thinned prior to dicing to aid the sawing operation and to allow the final assembled package thickness to be minimized. For semiconductor devices required to operate at high power levels, wafer thinning improves the ability to dissipate heat by lowering the thermal resistance of die. As final thickness is decreased, the wafer progressively becomes less able to support its own weight and to resist the stresses generated by post backgrinding processes. Thus, it is important to reduce the damage caused by backgrinding. 

UKAM Industrial Superhard Tools has the technology and expertise to help you optimize your backgrinding process to ultimate level of efficiency.

        UNDER CONSTRUCTION                                  

DICING BLADES

DICING SOLUTIONS

DICING BLADE GUIDE

Selecting Right Dicing Blade

Dicing Operation Recommendations

Optimizing Dicing Blade Performance

Trouble Shooting Dicing Problems

Getting the most from your Diamond Tools

Application Recommendations & Case Studies

What you should know before your buy your next dicing blade?


UKAM Industrial Superhard Tools   Division of LEL Diamond Tools International, Inc.

28231 Avenue Crocker, Unit 80  Valencia, CA 91355  Phone: (661) 257-2288  Fax: (661) 257-3833

e-mail: lel@ukam.com

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