ADVANCED MATERIALS, OPTICS, COMPOSITES, METALS & MANY OTHER MATERIALS
CUT™ 4002 Sectioning Saw with vice assembly, gravity weight feed, &
CUT™ 4002 (707kb)
Widely Used & Affordable Precision Diamond Saw available on the
market today. Designed for Fast
& Precision sectioning of printed circuit boards, ceramic
substrates, electronic packages, metallographic samples and many other materials. Providing
equal Precision, Productivity and
Versatility as High Cost Fully
Automatic Diamond Wafering Saws, at fraction of the price. Perfect
for Production and R & D facilities on a Budget.
Compare to any other low or high speed brand name Sectioning / Wafering
Saw. SMART CUT™ 4002 is able to withstand more exploitation, requires less
maintenance, and much easier to use. No complex programs or controls to
learn or restrict your sectioning operation.
stored below and applied to sample by rotating the blade. Saw table has
a large working area
measuring 6" x 10"
has no inhibiting lip. The saw housing is made from unbreakable
cross-linked polyethylene and the housing is guaranteed for life. The
saw has powerful 1/4 HP motor, running at variable speed of 400 to 3,400
RPM. Allowing the user to adjust RPM's to better fit sample/material
being cut. Motor is designed to insure that selected speed remains
constant at any load. Sectioning is done in closed environment by utilizing
Plexiglas Cover. Gravity Weight Feed allows samples to be sectioned
unattended (without operator presence). Most Samples / Materials can be
sectioned in seconds
or few minutes, with no material deformation, & preserving sample/material True Micro
Photonics / Optics
PRECISION SAW GUIDE:
Precision Sectioning Saw
Speed: 400 to 3,400 RPM.
Section most hard to machine materials in seconds, with no material
deformation, & preserving material true micro structure
Cutting Table for easy coolant & blade changes
blade guard accepts 3", 4", and 5" Diamond
Wafering & Abrasive Cut off Blades
Larger Working area 9" x 6-1/4" for oversize samples.
Perfect for oversize samples.
Powerful 1/4 Hp motor
Unbreakable cross-linked polyethylene prevents corrosion
/ Very Easy to use & operate
SMART CUT 4002 straight forward design allows the operator to concentrate
sectioning samples, not operating the machine
CUT™ 4002 - COMPLETE DIAMOND SECTIONING/WAFERING SOLUTION
Precision & Low Cost Manual Sectioning of a wide
variety of materials, such as: PCB Boards, Copper Lead Frames,
Silicon Wafers, Optical Glass, Ferrite Chunks, and many other
saw combined with longer sample sectioning capability. Can be
used for highest precision applications and for general low
deformation, low kerf loss sectioning. SMART CUT 4002 has
largest work surface area than any other saw in its class.
Designed to accommodate oversize samples.
4002 Vise Assembly is an adjustable guide that allow for accurate precision
cuts. Wing nuts are tightened to clamp the work piece securely in
The carriage advances slowly to feed material evenly into
the blade. Easily installed by bolting into place. Material
Samples can be accurately position in vise. Vise can be easily
adjusted to accommodate large variety of material thickness,
shapes, and configurations.
Table shown may easily be removed,
cleaned and adjusted. Blade guard may be adjusted and raised
to accommodate larger samples and better fit any particular
diamond wafering blade. Coolant is stored below and applied to
material / sample by rotating the blade.
straight forward design allows the operator to concentrate on
sectioning samples, not operating the machine.
Linear blade feeds into work
piece. Material is slowly feed into the rotating blade.
to 3,000 RPM
Range: 3", 4" and 5" Diameter
Material Cutting Depth: 1" (25.4mm)
5/8" or 1/2"
14" x 14" x 12"
Weight: 18 lb
Diamond Wafering Blade
4" x .012" Sintered
with 5mm Diamond Height.
We will help you chose the
right blade bond, diamond mesh size and concentration for your particular Material / Application
to select the Right Diamond Wafering Blade for your application
Variable Speed Precision
Grinding / Polishing Machine
CUT LP (397kb)
Perfect companion to
SMART CUT™ 4002 Precision Sectioning Saw
BOTH & SAVE
Blade Load / Very Simple to Use
surface work area in its class
performance & price per cut
withstand more exploitation that conventional precision sectioning
Application / Adjusts to fit any application
Material Structure Deformation
Surface Finish Quality / Minimize Burrs on Edges
for Organizations on a Budget
Gravity Weight Feed
Allows samples/material to be sectioned
unattended (without operator presence). Gravity weight feed propels
material / sample firmly positioned in vice assembly into rotating
blade. Weight can be adjusted depending on material diameter, hardness,
SMART CUT™ Synthetic
Water Soluble Coolant
of SMART CUT™ coolant added to deionized (DI)
water reduces material thermal stress, edge
cracking, assuring long-term
integrity of material
Since SMART CUT™ KOOL is
a coolant and
lubricant, both the diamond blade
and material benefit. Find
out more >>>
CUT™ Precision Diamond Sectioning have been successfully implemented
and proven in hundreds of advanced materials and applications. SMART
CUT™ Precision Manual and Semi-Automatic Saws provide Advanced
Material Laboratories and Manufacturing Facilities consistent performance
as fully automatic saws, at small fraction of the cost. With ever
increasing budget cuts, many facilities find the use of Precision Sawing/Sectioning
Equipment and Consumables cost prohibitive.
automatic Precision Sawing machines usually cost several thousand and even tens
thousands of dollars. Yet, most Advanced Material Manufacturing and R & D facilities very rarely require
the functionality of high cost, automatic sectioning saws. SMART
CUT™ series of Precision Diamond Saws have been designed to provide
the material researcher or engineer the same capabilities they would expect from
high cost automatic sectioning saws, at literally small fraction of the price. Start
Saving Money Today!
recognize that the Diamond Wafering / Sectioning Blade by itself is
perhaps the most important factor in your sectioning / precision diamond sawing
operation. The diamonds impregnated inside the bond matrix of the
wafering blade, are what actually participate in cutting action. No matter how
precision or well made your wafering saw. You will not be able to obtain the
material surface finish, and precision tolerances you need, if the blade you are
using is not right for your application.
Industrial Superhard Tools proprietary blade chemistry, precision manufacturing
methods, modern quality control methods, allow us to control and regulate the
dozens of variables that affect blade life, quality of cut, surface finish.
Reducing and often eliminating additional steps often required after sectioning.
All blades are manufactured and available from inventory to fit your specific
material, application, and surface finish requirements. We will work with
you to determine your needs, and develop the right bond formulation,
concentration, and grit sizes. SMART
CUT™ Precision Diamond Wafering
Blades are designed and specially selected to provide maximum possible blade
life, for your desired cut quality and speed.
Industrial Superhard Tools is one of the Leading Diamond Wafering Blade
Manufacturers, with one of the Largest
Inventory of Precision Diamond Wafering Blades
in the U.S. Over 4,000 diamond wafering
blades in stock, available in
different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh
sizes, and bond hardness's.
You are sure to find the Right Diamond Wafering Blade for
your application in stock and ready for same day delivery. If
you are not using these blades, you are paying too much.
you will save on the cost of consumables and Diamond Wafering Blades will more
than pay for the saw in short period of time.