Diamond & CBN Wafering Blades, Sectioning Saws, Grinders/Polishers for Sample Preparation

Customers include some of the Leading U.S. and International Laboratories, R & D, and Manufacturing Facilities. As well as Universities, Fortune 500 companies, Military, Government, Science & Space Organizations, and Machine Shops. Precision Diamond Wafering Blades are available from inventory in many different specifications, diamond concentrations, mesh sizes, bond hardness, & inside diameters. You can count on us to improve you sectioning operation to its ultimate efficiency.

WHAT YOU SHOULD KNOW BEFORE YOU BUY YOUR NEXT DIAMOND & CBN WAFERING BLADE? Getting the Most out of your Diamond Sectioning Operation (747kb) - 12 pages Diamond Wafering Blade Guide Diamond Wafering Bade Case Studies BUEHLER, STRUERS & LECO Item Number Cross-references

We offer Manufacturers Direct Prices.  Save up to 650%.  If you are not using our blades, you are missing out on superior performance, and paying too much. WHY PAY MORE?

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Compare Our Performance & Prices

Excellent Performance, even on Materials with a High Metallic Content (Check our Case Studies) Section Hard to machine materials 3 times faster Last 2.2 times longer Works on larger variety of materials (More Universal) No Smearing / No Material Deformation

Priced 3.41 times less expensive than the leading / conventional Brand Name Wafering Blades Non Magnetic Alloy Core / No Contamination Used with plain water, synthetic coolant, or oil Preserve True Material Micro Structure (Reduce & Eliminate secondary operations after sectioning) Check our Case Studies

Metal Bond (Sintered) Diamond & CBN Wafering Blades   Diamond Wafering Blades (889kb)  Used On: All Low & High Speed Wafering Saws, Sectioning Saws, Such as Buehler, Struers, Leco, & others. SMART CUT™ Precision New Generation Sintered (metal bonded) Diamond Wafering Blades are available from inventory in many different diamond concentrations, mesh sizes, bond hardness, & inside diameters.  Compare to any other brand name wafering blades. If you are not using these blades, you are paying too much.  more information...

Diamond Discs Metal & Resin Bond Designed for sample preparation of advanced, ultra hard & brittle materials, optical materials, composites, ceramics, metals, and petrography specimens. Our diamond discs can be used on all popular grinding & polishing machines designed for sample preparation. Such as Buehler, Struers, Leco & many others. A hard nickel alloy is used to rigidly bond a layer of sharp, blocky diamond to a steel backing. The sharp diamond particles cut cleanly with no edge rounding. Available from 6" to 30" (150mm to 762mm) in diameter. We offer electroplated (nickel bond), metal bond & resin bond bond diamond discs. Available with either magnetic or adhesive PSA backing, or no backing.     more...

Precision Wafering / Sectioning Saws UKAM Industrial Superhard Tools offers complete range of Precision Sectioning / Wafering Saws, Grinders / Polishers and accessories for advanced materials. From high speed sectioning of very large material samples, to precision low speed sectioning of even the most delicate specimens. Providing equal Precision, Productivity and Versatility as High Cost Fully Automatic Diamond Wafering Saws, at very affordable prices. Perfect for organizations on a Budget.      more...

 

Metallographic Consumables Abrasive Cut off Wheels Diamond Wafering Blades Bonded Abrasives Diamond Compounds Diamond Suspensions Polishing Cloth & Pads Diamond Discs Abrasive Powders & Slurries

High Precision Diamond & CBN Blades Used On: Wafering Saws, Sectioning Saws, Abrasive Cut off Saws, Surface Grinders, and other equipment.  Application: Precision Diamond Blades custom made to better fit your specific application / material. Provides smoother surface finish                  more...

Precision Blade Coolants When added to water SMART CUT™ synthetic water soluble coolant or Mineral Oil will improve sectioning operation.  Improve Cutting Speed, Increase Blade Life, Improve Surface Finish, Minimize Chipping, Preserve Material microstructure.   more >>>

HYBRID Diamond Bond Blades

  Hybrid Bond Wafering Blades (881kb)

Application: Designed to give you a smooth finish you need in a resin bond and long life you expect from a metal bond.  HYBRID Bond is designed to give you the smooth surface finish you need from a resin bond, and superior long life you expect from a metal bond. One HYBRID Bond Wafering Bade will last 3 to 5 resin bond blades put together. Compare to any other brand name wafering blades. If you are not using these blades, you are paying too much.  more...

  Slabbing Blades (715kb)

Application: slabbing and sawing larger pieces of materials. Available from 18" to 72" in diameter.  SMART CUT™ series precision sintered (metal bonded) diamond slabing blades are the highest overall performance blades available today. Manufactured utilizing SMART CUT™ technology, these blades will give you the best performance and price per cut. Providing consistent results you can count on everyday.     more...

Resin bond diamond wafring blades offer superior cut quality than any type diamond wafering blade available. Recommended for applications where cut quality and surface finish is very important. Compared to their sintered (metal bond) wafering blade counterparts. Resin Bond Diamond & CBN Waferings offer far superior cut quality than the finest size metal bond (sintered) bade. Recommended for cutting hard, brittle or delicate materials including ceramics, carbides, composites and exotic metals where low heat generation or improved surface finish is desired. Most commonly used at higher speeds. CBN, Resin bond Wafering Blades are recommended for sectioning hard steels above Rc 60 at high speeds.   more...

Diamond Band Saw Blades

Diamond Band Saw Blades (196kb)

Diamond Band Saw Blades have proven the be an effective diamond machining tools on a large variety of materials and applications. With diamonds firmly attached to ultra thin metal body, Diamond Band Saw Blades remain the tool of choice for many diamond cutting and machining jobs. Only the highest quality raw materials are used in the manufacturing process. Manufacturing process is carefully controlled, matching your application with the right bond type, grit size, bond hardness and composition.  more...

Dressing Sticks

Dressing Sticks are available in different sizes, grits, and abrasive types. Available in silicon carbide or alumina oxide (soft bond). Dressing sticks break down differently under a variety of conditions. The dressing stick used must be compatible with the bond and mish size (grit) of the diamond tool, in addition to the RPM's of the machine. Silicon carbide crystals are less friable and are sharper than alumina oxide crystals which are more friable and break down easier. more...

Nickel Bond Diamond & CBN Wafering Blades

Nickel Bond Diamond & CBN Wafering Blades usually have a single layer of diamonds, held by a tough durable nickel alloy. diamond particles to protrude from the bond matrix, providing a free, faster cutting action with minimum heat generation. Recommended for cutting softer and more gummy materials, where sintered (metal bond) diamond wafering blades load up or glaze over frequently. Nickel bond diamond wafering blades are particularly well suited for cutting thermosetting plastics, GRP, pre-sintered and pre-fired (green) materials, electro carbons, graphite, soft ferrites, farinaceous products, deep frozen fish, pones, pc boards, and etc. CBN (cubic boron nitride) Wafering Blades are mainly used on tool and die steels, high alloy steels, and nickel rich alloys.    more >>>

DIAMOND PASTE

POLYCRYSTALLINE & MONOCRYSTALLINE

Precision formulated and graded for most demanding applications & your specifications. Excellent for sample preparation, metallographic, materials research, mold, die and tool polishing, toolroom use, polishing to final tolerance of ceramic parts, initial charging of lapping plates and discs, and other processes that require mirror finish and close tolerance performance.

DIAMOND SLURRY

POLYCRYSTALLINE & MONOCRYSTALLINE 

Precision formulated and graded for most demanding applications & your specifications. Polycrystaliline diamond has more cutting surfaces per particle, resulting in higher removal rates. Monocrystalline is more cost affective and has good stock removal and surface finish quality for most common applications.

DIAMOND POWDER (MESH, MICRON, & NANO) 

very tightly graded diamond powder from mesh to nano to your specifications for polishing large variety of materials

Metallographic Polishing Pads

Polishing Pads can be used to remove the necessary bulk material while maintaining excellent flatness. As sell as removing sectioning damage done by cutting and coarse grinding. A softer polishing pad can be used to improve the surface quality prior to examination. The polishing pads are available with either a pressure sensitive adhesive (PSA) or with magnetic backing.

Resin Bond Diamond Discs

provide rapid removal of polishing and grinding marks and high spots on all types of materials. Diamond resin bonded to a flexible surface. will out-perform silicon carbide discs and diamond compound finishing systems. All resin bond diamond discs have a pressure sensitive adhesive backing. They will adhere to most lags or backing plates.