{"items":"\n\t\t\t\t\t\t\t\t\t\t\t\n<article id=\"post-144405\" class=\"wd-post blog-design-default blog-post-loop blog-style-bg wd-add-shadow wd-col post-144405 post type-post status-publish format-standard has-post-thumbnail hentry category-semiconductor-industry\">\n\t<div class=\"article-inner\">\n\t\t\t\t\t<header class=\"entry-header\">\n\t\t\t\t\t\t\t\t\t<figure id=\"carousel-952\" class=\"entry-thumbnail\">\n\t\t\t\t\t\t\n\t\t\t\t\t\t\t<div class=\"post-img-wrapp\">\n\t\t\t\t\t\t\t\t<a href=\"https:\/\/ukam.com\/optimizing-qfn-package-dicing-process-using-smart-cut-dicing-blades\/\">\n\t\t\t\t\t\t\t\t\t<img width=\"1024\" height=\"1024\" src=\"https:\/\/ukam.com\/wp-content\/uploads\/2023\/06\/image-1031.webp\" class=\"attachment-large size-large\" alt=\"\" srcset=\"https:\/\/ukam.com\/wp-content\/uploads\/2023\/06\/image-1031.webp 1024w, https:\/\/ukam.com\/wp-content\/uploads\/2023\/06\/image-1031-300x300.webp 300w, https:\/\/ukam.com\/wp-content\/uploads\/2023\/06\/image-1031-350x350.webp 350w, https:\/\/ukam.com\/wp-content\/uploads\/2023\/06\/image-1031-600x600.webp 600w, https:\/\/ukam.com\/wp-content\/uploads\/2023\/06\/image-1031-150x150.webp 150w, https:\/\/ukam.com\/wp-content\/uploads\/2023\/06\/image-1031-768x768.webp 768w, https:\/\/ukam.com\/wp-content\/uploads\/2023\/06\/image-1031-154x154.webp 154w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t<div class=\"post-image-mask\">\n\t\t\t\t\t\t\t\t<span><\/span>\n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t\t\n\t\t\t\t\t<\/figure>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t<div class=\"post-date wd-post-date wd-style-with-bg\">\n\t\t\t\t<span class=\"post-date-day\">\n\t\t\t\t\t01\t\t\t\t<\/span>\n\t\t\t\t<span class=\"post-date-month\">\n\t\t\t\t\tJun\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\t\t\t\n\t\t\t<\/header><!-- .entry-header -->\n\n\t\t<div class=\"article-body-container\">\n\t\t\t\n\t\t\t\t\t\t\t\t\t<div class=\"meta-categories-wrapp\"><div class=\"meta-post-categories wd-post-cat wd-style-with-bg\"><a href=\"https:\/\/ukam.com\/category\/semiconductor-industry\/\" rel=\"category tag\">semiconductor industry<\/a><\/div><\/div>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t<h3 class=\"wd-entities-title title post-title\">\n\t\t\t\t\t\t<a href=\"https:\/\/ukam.com\/optimizing-qfn-package-dicing-process-using-smart-cut-dicing-blades\/\" rel=\"bookmark\">Optimizing QFN Package Dicing Process  Using SMART CUT\u00ae Dicing Blades<\/a>\n\t\t\t\t\t<\/h3>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t<div class=\"entry-meta wd-entry-meta\">\n\t\t\t\t\t\t\t\t\t<ul class=\"entry-meta-list\">\n\t\t\t\t\t\t\t\t\t<li class=\"modified-date\">\n\t\t\t\t\t\t\t\t<time class=\"updated\" datetime=\"2026-04-01T11:50:44+00:00\">\n\t\t\tApril 1, 2026\t\t<\/time>\n\t\t\t\t\t\t\t<\/li>\n\n\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"meta-author\">\n\t\t\t\t\t\t\t\t\t\t\t\t<span>Posted by<\/span>\n\t\t\n\t\t\t\t\t<img alt='author-avatar' src='https:\/\/ukam.com\/wp-content\/uploads\/2025\/05\/aydan-min.png' srcset='https:\/\/ukam.com\/wp-content\/uploads\/2025\/05\/aydan-min.png 2x' class='avatar avatar-32 photo sab-custom-avatar' height='32' width='32' \/>\t\t\n\t\t<a href=\"https:\/\/ukam.com\/author\/ayan\/\" rel=\"author\">\n\t\t\t<span class=\"vcard author author_name\">\n\t\t\t\t<span class=\"fn\">Ayan Sadyk<\/span>\n\t\t\t<\/span>\n\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t<li class=\"meta-reply\">\n\t\t\t\t\t\t\t<a href=\"https:\/\/ukam.com\/optimizing-qfn-package-dicing-process-using-smart-cut-dicing-blades\/#respond\"><span class=\"replies-count\">0<\/span> <span class=\"replies-count-label\">comments<\/span><\/a>\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t\t<\/div><!-- .entry-meta -->\n\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\n\t\t\t\t                    <div class=\"entry-content wd-entry-content\">\n\t\t\t\t\t\t<p>Dicing QFN packages presents several challenges due to the composition of materials and the precision required for clean, defect-free cuts. These challenges arise from the multi-layered structure of QFN packages, which often include tin (Sn) coatings, nickel\/palladium (Ni\/Pd) plating, and composite substrate materials. Each of these layers introduces specific difficulties that must be managed to ensure high-yield, high-quality production.<\/p>\n\n\t\t\t\t\t\t\t\t\t\t\t<\/div><!-- .entry-content -->\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<p class=\"read-more-section\">\n\t\t\t\t\t\t<a class=\"btn-read-more more-link\" href=\"https:\/\/ukam.com\/optimizing-qfn-package-dicing-process-using-smart-cut-dicing-blades\/\">Continue reading<\/a>\t\t\t\t\t<\/p>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\n\t\t\t\t\t<\/div>\n\t<\/div>\n<\/article><!-- #post -->\n\n\n\t\t\t\t\t\n\t\t\t\t\t","status":"no-more-posts","nextPage":"?woo_ajax=1","currentPage":"https:\/\/ukam.com\/author\/ayan\/page\/2"}