BOND DIAMOND & CBN
WAFERING & CUT OFF BLADES
bond diamond wafring blades offer superior cut quality than any type diamond
wafering blade available. Recommended for applications where cut quality
and surface finish is very important. Compared to their sintered (metal bond)
wafering blade counterparts. Resin Bond Diamond & CBN Waferings offer far superior
cut quality than the finest size metal bond (sintered) bade.
Recommended for cutting hard, brittle or delicate materials including
ceramics, carbides, composites and exotic metals where low heat generation or
improved surface finish is desired. Most commonly used at higher speeds. CBN,
Resin bond Wafering Blades are recommended for sectioning hard steels above Rc
60 at high speeds.
phenolic resin as the binder, diamond abrasive as cutting media, ceramic &
other advanced components as filler. UKAM Industrial Resin Bond
Diamond & CBN Wafering Blades are manufactured with advanced molding process. Available in a large
variety of geometries, diamond sizes, diamond concentrations, and bond
Bond is the softest of all the bonds, frequently used in applications that
require a smooth surface. This type of wafering blades is used on majority of ultra
hard & brittle materials. Resin bond wafering blades allow the bond matrix to
wear faster, and allow for diamond particles/crystals to break out of their
matrix faster, so that new sharp diamond particles become exposed. This self
sharpening characteristic of resin bond wafering blades, based on faster bond wear
out is what make this blade an excellent choice for large variety of ultra hard
and brittle materials.
Discounts available. Other
Standard Arbor Sizes 3/4", 1", 1 1/4", 20mm, and 30mm available.
We can make just about any ID (inside diameter) arbor size by request.
100% Quality Guaranteed.
Diamond Blade by itself is
perhaps the most important factor in your precision diamond sawing
operation. The diamonds impregnated inside the bond matrix of the
diamond blade, are what actually participate in cutting action. No matter how
precision or well made your saw. You will not be able to obtain the
material surface finish, and precision tolerances you need, if the blade you are
using is not right for your application. UKAM
Industrial Superhard Tools proprietary blade chemistry, precision manufacturing
methods, modern quality control methods, allow us to control and regulate the
dozens of variables that affect blade life, quality of cut, surface finish.
Reducing and often eliminating additional steps often required after cutting.
All blades are manufactured and available from inventory to fit your specific
material, application, and surface finish requirements. We will work with
you to determine your needs, and develop the right bond formulation,
concentration, and grit sizes. SMART CUT ™ Precision Diamond Blades are
designed and specially selected to provide maximum possible blade life, for your
desired cut quality and speed.
Industrial Superhard Tools is one of the Leading Precision Blade
Manufacturers, with one of the Largest
Inventory of Precision Diamond Blades
in the U.S. Over 4,000 Precision &
Ultra Thin diamond
blades in stock, available in
different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh
sizes, and bond hardness's.
You are sure to find the Right
Precision Diamond Blade for
your application in stock and ready for same day delivery. If
you are not using these blades, you are paying too much.
DIAMOND WAFERING BLADE
Most diamond & CBN Wafering Blade Users already know which blade to use for their
application. This information is typically based
on the blade item number already used or recommendation provided by saw manufacturer or consumables supplier. Blade specification is identified by item number for fast and easy reordering.
Some obtain this information through literature or recommendation given by
their customer support representative. Although the blade you are using now may be working satisfactory.
Do you really know if it is the best solution to your needs?
Many clients waste valuable time & money by using incorrect blade for their
application. Some use blade with too fine size diamond particles, causing excessively long cutting times and material burning. Some use to thin of a blade for their material diameter/shape and prematurely bend, damage, or chip the diamond section.
Most consumable vendors do not spend the time to educate the user on the wide variety
of blade specifications and options available today. Nor provide the full blade specification per ANSI (American
National Standards Institute) diamond & CBN blade labeling standards.
UKAM Industrial Superhard Tools specializes in manufacturing Diamond & CBN wafering & cut off blades for large variety of industries & applications (not just for laboratory / sample
preparation) use. We have in stock over 20,000 diamond & CBN blades in wide variety of different specifications (not just
specifications indicated above). We understand that your success depends on select the right tools & consumables, and optimizing them to best fit your needs. We believe that the best client is a well-informed client. The more you understand about what we can do for you, the better our partnership will be. On our web site you will find the Most Comprehensive Source of Information on Everything you wanted to know diamond & cbn wafering blades, cutting, grinding, & polishing. We are focused on your long term success and take great pride in helping you grow and prosper.
Concentration – Diamond
Concentration is still a factor in determining the life and cutting
speed of your Diamond Sectioning/Wafering Blade.
concentration is recommended and usually used for cutting softer and
more abrasive types of materials. However, the trade off is
significantly slower cutting speed. Low diamond concentration is
recommended and widely used for cutting ultra hard and brittle
Diamond Concentration - typically
low concentration wafering blades should be for cutting ultra hard and
brittle materials such as ceramics and glass. In Low Concentration
Wafering Blades, diamond works by fracture process. Pressure on each
diamond crystal/particle is higher which provides enough stress to chip
off small flakes in the cut.
Diamond Concentration - High
concentration diamond wafering blades are recommended for cutting metals,
plastics and polymers. In this application, materials cut by a plowing
mechanism. In this applications diamond plough through the material, work
hardened strips of materials become brittle and break off. The greater
number of diamond by volume, the quicker the cutting action will be.
Increasing the number of diamond s also lowers the per unit force. For
metals where it is possible to induce deep deformation layers, a lower per
unit force is desirable to reduce the deformation during the cut.
& CBN Particle size -
Diamond Mesh Size plays a major role in determining your
cutting speed, cut quality/surface finish, level of chipping you
will obtain, and material microstructure damage you will obtain.
Diamond Mesh size does have considerable effect on cutting
speed. Coarse Diamonds are larger than finer diamonds and will cut
faster. However, the tradeoff is increase in material micro damage.
If you are cutting fragile, more delicate materials then finer mesh
size diamond wafering blades are recommended.
Thickness – Wafering blade
thickness typically ranges from .006” to .040” (1mm). Thinner
and thicker wafering blade are available, frequently from stock upon
Kef thickness typically
increases with blade diameter (in proportion to diameter of the
Kerf is the amount of material removed from the material/sample due
to the thickness of blade passing though the material/sample. Blade
thickness is important for users requiring most minimal amount of
material loss during sectioning. For
example if the user requires precision position of the cutting plane
relative to the detail on the sample (IC circuit for example), a thinner
and smaller diameter blade would be best for this application. Blades
ranging from 3” to 5” (75mm to 125mm) in diameter and thickness
.006” to .015” (0.2mm to 0.4mm) would be bet suited for this purpose.
There are large variety of factors that will contribute to optimal blade
thickness for your material/application Including your desired cutting
speed, load/feed rate, material diameter, thickness, hardness, density,
and shape. As well as skill & experience of the operator. Thicker
wafering blades are more stiff and can whistand higher loads/feed rates.
Another advantage of thicker kerf blades is they are more forgiving to
operator error and abuse. Thicker kerf blade are recommended for use in
environment where large number of individuals will be sharing and using
same equipment. Perfect for less experienced and novice saw operators,
such as in University laboratory.
Diameter – typically
wafering blade diameters range form 3” (75mm) to 8” (200mm).
Wafering blade diameter should be selected based on material
diameter and thickness being cut.
Smaller diameter wafering blades
are thinner than the larger diameter blades and are more prone to
bending and warping. Although large diameter blades are thicker,
they are typically used for cutting larger and heavier samples at
higher loads and speeds than smaller blades
Hardness – Ability of the
bond matrix to hold diamonds. As the hardness of the bond is
increased, its diamond retention capabilities increase as well.
However the trade off is slower cutting speed. Life of the diamond
blade is usually increased with hardness of its bond matrix. Bonds
are designated on their scale of hardness from Soft, Medium, and
Hard. There are dozens of variations and classification schemes
based on bond degree of hardness or softness. Using
diamond blades with optimum bond hardness for your application is
important to successful precision diamond sawing operation. Bond matrix
that is too soft for the material being cut will release diamond
particles faster than needed, resulting in faster wear and shorter
diamond blade life. On other hand bond matrix that is too hard will
result in much slower cutting speeds and require constant dressing to
expose the next diamond layer. As rule of thumb, harder materials such
as sapphire and alumina generally require a softer bond. Whereas softer
and more brittle materials require a harder bond.
Type - Metal bonding offers
long life and durability, while resin bonding creates less heat,
provides better surface finish and is well suited for cutting
hard, delicate or brittle materials.
Rates – load/feed rate
applied to wafering blades typically vary from 10-1000 grams.
Generally, harder specimens are cut at higher loads and speeds
(e.g. ceramics and minerals) and more brittle specimens are cut at
lower loads and speeds (e.g. electronic silicon substrates). The
Speeds/RPM’s you are using, shape/geometry of the specimen, and
how the specimen is being clamped/hold in place will affect the
load that can be used for your application.
Blade Speeds/RPM’s - Most wafering
blades are used between 50 to 6,000 RPM’s
Typically harder and
more denser materials such as Silicon Carbide, are cut at higher
RPM’s/speeds Where more brittle materials such as silicon wafers
and gallium arsenide are cutting at lower RPM’s. Low Speed saws
RPM’s are typically limited from 0 to 600 RPM’s. Where high
speed saws offer much large variety of cutting speeds from 0 to
In 1998 UKAM
Industrial Superhard Tools, Division
of LEL Diamond Tools International, Inc. introduced
diamond blades. This technology
matrix. Making sure
working where you
most. (Please, see
cutting performance – each diamond
work horse. Diamonds
most. You get
and bond. Some unique
benefits & advantages of SMART CUT™ technology:
glazing – requires minimal dressing, the bond renews itself
cutting action - Diamond blades manufactured utilizing this
technology are much more aggressive than your conventional blades. They cut
faster, still leaving behind a smooth finish.
universal & longer lasting - These diamond blades are
designed to work on virtually any material you can find. You can cut very hard
materials, than switch to cutting very soft materials and the blade will
maintain the same consistent performance. 7mm diamond depth allows the blade to
last 80% to 40% longer on the
coolant system - these blades are designed to cut with or without oil.
We feel it is more preferable to the user to use water as a coolant. Oil does
not a proper coolant for this procedure, as most other manufacturers would
suggest. Water is a true organic coolant, witch does not leave the material
being cut oily or greasy.