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Getting the Most from your Diamond Tools (171kb)
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SMART CUT technology (761kb)
HYBRID Diamond Bond
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SMART CUT SERIES

 REDUCED WEAR RESIN BOND  - DIAMOND / CBN DICING BLADES 

NEW GENERATION & TECHNOLOGY

USED ON ANY DICING/SLICING SAW & LARGE VARIETY OF MATERIALS/APPLICATIONS.

  • Longer Life than any other Resin Bond Blade in Industry

  • Self-sharpening matrix

  • Superior cut quality

  • The widest variety of bond matrixes

   

BENEFITS:

  • Increase Blade Life

  • Reduce Chipping

  • Reduce Blade Wear

  • Increase Process Consistency

  • Maintain Consistent Cutting Speed

  • Reduce Blade Change & Mounting Cost

  • Reduce Cost

ADVANTAGES:

  • maximum cutting performance

  • no glazing

  • faster cutting action

  • improved surface finish quality

  • better coolant retention

  • No Material Deformation

  • No Contamination

SMART CUT Resin series New Generation & Technology Dicing Blade is the highest performance Resin Bond Dicing Blade available today! SMART CUT Resin Dicing Blade lasts longer than any resin bond diamond dicing blade and maintains better form & shape consistently through its life. Resin Bond dicing blade are typically more forgiving, self dressing, and freer cutting. Excellent choice for Ultra Hard & Brittle Materials. Recommended for applications where cut quality and surface finish is very important.

Manufactured utilizing SMART CUT technology, each  diamond  works  like  a  small  horse. Diamonds  come  in  contact  with  the  material  in  the  right  place  and  at  the  right  time,  working  where  you  need  them  most. You  get  the  maximum  use  out  of  diamond  and  bond.

Diamonds are oriented inside metal matrix, so that every diamond is better able to participate in cutting action.

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SMART CUT Resin series New Generation & Technology Dicing Blade are produced using phenolic resin as the binder, diamond abrasive as cutting media, ceramic & other advanced components as filler. UKAM Industrial Resin Bond Blades are manufactured with advanced molding process. available in a large variety of geometries, diamond sizes, diamond concentrations, and bond harnesses.

Resin bond dicing blades are made with high temperature phenolic resin, diamond particles, ceramic filler and often additional additives. Resin Bond is the softest of all the bonds, frequently used in applications that require a smooth surface. This type of dicing blade is used on majority of ultra hard & brittle materials. Resin bond dicing blades allow the bond matrix to wear faster, and allow for diamond particles/crystals to break out of their matrix faster, so that new sharp diamond particles become exposed. This self sharpening characteristic of resin bond dicing blades, based on faster bond wear out is what make this blade choice in almost half of all dicing application. Typical Resin Bond Diamond Blades last less than Sintered (Metal Bond) diamond blades, but more than electroplated (nickel bond) diamond blades. finish and minimum amount of chipping.  

Some disadvantages of resin bond dicing blades is resin bond must remain very fragile in order to expose new diamonds. Resin bond is the softest of the all the dicing bond matrixes. For this reason, strong and high quality diamonds cannot be used in a resin bond. High quality diamonds are harder than a resin bond matrix, and would soon disintegrate the bond that keeps them in place. This brings about the need for frequent blade dressing, causing the cut to loose its roundness or form. 

Another disadvantage of Resin bond is its high wear rate, lack of stiffness, and thickness limitation. Resin bond can cut hard & brittle materials fast, but will provide much shorter life. Thinnest blades that can be produced in resin bond is .004". Many of the resin bond dicing blade weaknesses and limitation have been resolved by utilizing different phenolic resin types, mixtures, fillers, and molding techniques in our New Generation Extended Wear Resin Bond and Hybrid bond dicing blades. Hence increasing their field or use in greater amount of applications.


SMART CUT SERIES (SC) 1A8 RESIN BOND DICING BLADE SPECIFICATIONS

   Size designation:  D x TE x H, where: D-Outside Blade Diameter, TE Blade Thickness, H- Blade Inside Diameter.

Note: Our standard Tolerance on Outside Diameter for all blades is  +/-.002, tolerance. Higher tolerances are available upon request

HOW TO ORDER 

*Diamond or CBN concentration Material / Application Abbreviations
N/N  D

  (Outer diameter)

TE

(Blade thickness)

H

(Inside diameter)

T

(Blade tolerance)

1

4.60 (116.84)

.002 - .080

(.051   2.0)

 3.50

(88.9)

 

   1,2,3,4,5,6,7,8
2

4.50

(114.3)

 

.002 - .080

(.051   2.0)

    3.50

   (88.9)

 

   1,2,3,4,5,6,7,8
3

3.00

(76.2)

.002  - .080

(.051   2.0)

1.575

(40)
   1,2,3,4,5,6,7,8
4

3.00

(76.2)

.002 - .080

(.051   2.0)

   1.250

  (31.75)
   1,2,3,4,5,6,7,8
5 2.052.2835

(5258)

 

.002  - .080

(.051   2.0)

  1.575

  (40)

 

   1,2,3,4,5,6,7,8

25, 35,50,

75,100,

125,150,

200

PLEASE SEE TABLE BELOW FOR MATERIAL ABBREVIATIONS

 

ABBREVIATIONS

TE

Thickness of the blades is available in .0001 increments

T1...T8

Tolerance of the blade thickness. Available tolerances

 

  T1-.0001( 2.5m); T2- .0002( 5m); T3- .0003( 7.5m); T4- .0004( 10m)

 

T5-.0005( 12.5m); T6- .0006( 15m); T7- .0007( 17.5m); T8- .0008( 20m);

All sizes in parentheses are in millimeters (mm). An example (76.2) is indication of 76.2 mm.

* LOW CONCENTRATION AVAILABLE ON REQUEST.

All sizes in parentheses are in millimeters (mm). An example (76.2) is indication of 76.2 mm.

* LOW CONCENTRATION AVAILABLE ON REQUEST.

RESIN BOND DIAMOND DICING BLADE 

SMART CUT SERIES (SC)  Selection Guide

The guide below will help you select the right blade for your material/application, fast and easy. Just locate the material you are working with. On right hand side of material and abbreviation you will find recommended diamond particle size, bond hardness to use for your application. Along with the SMART CUT bond series recommendation.

Material Material Abbreviation Diamond Particle Size SMART CUT Blade Series Bond Hardness
FIBERGLASS FGS D126, D107, D91, D76, D54, D46      SC1R VVVHB, VVHB, VHBH, HBH, HBM 
CARBON CN D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
CERAMICS FRP, CS D54, D46, 45m, 30m, 15m SC5R SBL, MHBL, MHBM
CARBIDE TGC CE D91, D76, D54. SC3R VVHB, VHBH, HBH, HBM  
QUARTZ QZ D54, D46, 45m, 30m, 15m SC5R SBL, MHBL, MHBM
OPTICAL GLASS OG D54, D46, 45m, 30m, 15m SC5R SBL, MHBL, MHBM
PHOTONICS GLASS PG D54, D46, 45m, 30m, 15m SC5R SBL, MHBL, MHBM
MULTI-LAYER CERAMIC CAPACITORS BGA CSP MLCC 30m, 15m, 9m, 6m, 45m SC6R SBL, MHBL, MHBM
THIN FILM DISK DRIVE HEADS, ALUMINUM TITANIUM CARBIDE PZT; TFDDH D54, D46, 45m, 30m, 15m SC5R SBL, MHBL, MHBM
SAPPHIRE, AL2O3 +Fe +Ti SE D54, D46, 45m, 30m, 15m SC5R SBL, MHBL, MHBM
RUBY AL2O3 + Cr RY D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
LITHIUM NIOBITE LiNbO3 LN 30m, 15m, 9m, 6m, 45m SC6R SBL, MHBL, MHBM
LITHIUM TANTILATE LiTaO3 LT 30m, 15m, 9m, 6m, 45m SC6R SBL, MHBL, MHBM
ALUMINA (HYBRID SUBSTRATES AND CERAMICS PACKAGES AL D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
QFN, COPPER + EPOXY MOLDING QFN D126, D107, D91, D76, D54, D46   SC1R     
ALUMINUM NITRIDE ALN D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
ZIRCONIA (ZrO2) ZA D54, D46, 45m, 30m, 15m SC5R SBL, MHBL, MHBM
BORON CARBIDE (B4C) BC D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
TITANIUM DIBORIDE (TiB2) TD D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
GLASS + SiO2 GSi 30m, 15m, 9m, 6m, 45m SC6R SBL, MHBL, MHBM
SILICON Si D54, D46, 45m, 30m, 15m SC5R SBL, MHBL, MHBM
SILICON-CARBIDE SiC SC D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
ZINK-SELENIDE ZnSe ZS D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
BARIUM-TITINATE BTI      
BISMUTH-SILICATE Bi12Si22 BS D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
BISMUTH-TELLURIDE BTE D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
GGGNaGd (W04)2  G2 D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
GARNET G D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
KOVAR NiFeCo K 30m, 15m, 9m, 6m, 45m SC6R SBL, MHBL, MHBM
SILICON NITRIDE Si3N4 SN D91, D76, D54, D46, 45m, 30m , 15m SC4R VVVSB, VVSB, VSB
STONE SE D107, D91, D76. SC2R    VVHB, VHBH, HBH, HBM
NON-FERROUS ABRASION RESISTANT MATERIALS NFARS D107, D91, D76. SC2R    VVHB, VHBH, HBH, HBM
HIGH SPEED TOOL STEELS HSTS B126, B107, B91, B76, B54, B46 SC7R   VVVHB, VVHB, VHBH, HBH, HBM 
DIE STEELS DS B126, B107, B91, B76, B54, B46 SC7R   VVVHB, VVHB, VHBH, HBH, HBM 
HARDENED CARBON STEEL HCS B126, B107, B91, B76, B54, B46 SC7R   VVVHB, VVHB, VHBH, HBH, HBM 
INCONEL IL B126, B107, B91, B76, B54, B46 SC7R   VVVHB, VVHB, VHBH, HBH, HBM 
MONEL ML B126, B107, B91, B76, B54, B46 SC7R   VVVHB, VVHB, VHBH, HBH, HBM 
RENE RE B126, B107, B91, B76, B54, B46 SC7R   VVVHB, VVHB, VHBH, HBH, HBM 
WASPALLOY WY B126, B107, B91, B76, B54, B46 SC7R   VVVHB, VVHB, VHBH, HBH, HBM 
HARD FERROUS SUPERALLOYS HFS B126, B107, B91, B76, B54, B46 SC7R   VVVHB, VVHB, VHBH, HBH, HBM 

 

MATERIAL / APPLICATION ABBREVIATIONS
FGS FIBERGLASS AL ALUMINA (HYBRID SUBSTRATES AND CERAMICS PACKAGES  G2 GGGNaGd (W04)2
CN CARBON QFN COPPER + EPOXY MOLDING G GRANAT
FRP, CS CERAMICS ALN ALUMINUM NITRID K KOVAR NiFeCo
CE CARBIDE TGC ZA ZIRCONIA (ZrO2) SN SILICON NITRIDE Si3N4
QZ QUARTZ BC BORON CARBIDE (B4C) SE STONE
OG OPTICAL GLASS TD TITANIUM DIBORIDE (TiB2) NFARS NON-FERROUS ABRASION RESISTANT MATERIALS
PG PHOTONICS GLASS GSi GLASS + SiO2 HSTS HIGH SPEED TOOL STEELS
BGA CSP MLCC MULTI-LAYER CERAMIC CAPACITORS Si SILICON DS DIE STEELS
PZT; TFDDH

THIN FILM DISK DRIVE HEADS, ALUMINUM TITANIUM CARBIDE

SC SILICON-CARBIDE SiC HCS HARDENED CARBON STEEL
SE SAPPHIRE, AL2O3 +Fe +Ti ZS ZINK-SELENIDE ZnSe ML MONEL
RY RUBY AL2O3 + Cr BTI BARIUM-TITINATE IL INCONEL
LN LITHIUM NIOBITE LiNbO3 BS BISMUTH-SILICATE Bi12Si22 RE RENE
LT LITHIUM TANTILATE LiTaO3 BTE  BISMUTH-TELLURIDE WY WASPALLOY
HFS HARD FERROUS SUPERALLOYS.

ABRASIVE (Diamond/CBN) PARTICLES CONCENTRATION AVAILABLE 

SC1R

HIGH CONCENTRATION

SC5R

LOW CONCENTRATION

SC2R

HIGH CONCENTRATION

SC6R

LOW CONCENTRATION

SC3R

HIGH CONCENTRATION

SC7R

HIGH CONCENTRATION

SC4R

LOW CONCENTRATION

 

 

 

DICING BLADE  SMART CUT (SC)

 **** MATERIAL / APPLICATION ***PARTICLE SIZE BOND SYSTEM/HARDNESS

 SC1R  

QFN, FRP   

 D126, D107, D91, D76, D54, D46     

VVVHB, VVHB, VHBH, HBH, HBM 

 SC2R 

STONE, NFARS 

D107, D91, D76.

   VVHB, VHBH, HBH, HBM 

SC3R

 CE, BGA, FGS  

 D91, D76, D54.

VVHB, VHBH, HBH, HBM  

SC4R

AL, B4C, SC, SN, TD, CN,BTE,G2, BS

 D91, D76, D54, D46, 45m, 30m , 15m

VVVSB, VVSB, VSB

SC5R

ZA, CS, QZ, OG, PG, SE, PZT, Si     

D54, D46, 45m, 30m, 15m 

SBL, MHBL, MHBM

SC6R

  FDDH, K, ZS, GSi, LN, LT, MLCC          

30m, 15m, 9m, 6m, 45m

SBL, MHBL, MHBM

SC7R

HSTS, DS, HCS, ML, IL, RE, WY, HFS  

B126, B107, B91, B76, B54, B46

VVVHB, VVHB, VHBH, HBH, HBM 

*** Letter Abbreviations: D-FOR DIAMOND, B -FOR CBN.

**** If Material or Application is not listed in the chart above, please inquire. We can provide proper blade specification for just about any type of material/application. 

ABRASIVE PARTICLES CONCENTRATION FOR SMART CUT (SC) SERIES DICING BLADES  

HIGH CONCENTRATION:   75=18.75% 100=25% 125=31.25% 150=37.5% 200=50%
LOW CONCENTRATION 50=12.5% 35=8.75% 25=6.25%    

 

ABRASIVE (DIAMOND / CBN) PARTICLES SIZES AVAILABLE

Diamond/CBN

Mesh Size

USA

80

100

100

120

120

140

140

170

170

200

200

230

230

270

270

325

325

400

400

500

 

500

 

600

 

 

800

 

1000

 

1200

 

1800

  3000

  6000

 

 

8000

Diamond/CBN

Size

FEPA (D), (B)

 

181

 

 

151

 

126

 

107

 

91

 

76

 

64

 

54

 

46

 

40

 

35

 

30

 

25

 

20

 

15

 

9

 

6

 

4

 

3

Diamond/CBN

Size Range In m

 180

150

150

125

125

106

106

90

90

75

75

63

65

53

53

45

45

38

50

30

40

30

36

22

30

20

25

15

20

10

12

6

  8

4

6

2

4

2

 Minimum

Blade thickness

(Inches)

 

.016

 

.014

 

.012

 

.010

 

.009

 

.008

 

.007

 

.006

 

.005

 

.004

 

.004

 

.003

 

.003

 

.003

 

.002

 

.0015

 

.0015

 

.0015

 

.0015

 

 

 

 

 

 

 

 

 

  Letters designation D-For diamond, B-For CBN.

These diamond sizes do not represent FEPA sizes, they are for reference only.

Minimum blade thickness for each diamond size is available on request.  

DICING BLADES

DICING SOLUTIONS

DICING BLADE GUIDE

Selecting Right Dicing Blade

Dicing Operation Recommendations

Optimizing Dicing Blade Performance

Trouble Shooting Dicing Problems

Getting the most from your Diamond Tools

Application Recommendations & Case Studies

What you should know before your buy your next dicing blade?


UKAM Industrial Superhard Tools   Division of LEL Diamond Tools International, Inc.

28231 Avenue Crocker, Unit 80  Valencia, CA 91355  Phone: (661) 257-2288  Fax: (661) 257-3833

e-mail: lel@ukam.com

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