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Getting the Most from your Diamond Tools (171kb)
Getting the Most from your Diamond Sawing Operation (125kb)
Select the Right Diamond Blade for your Application (151kb)
Getting the Most from your Diamond Sectioning Operation (747kb) 
Ultra Thin & High Precision Diamond Blades Main Catalog (2.0 MB)
SMART CUT™ technology (761kb)
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SMART CUT Dicing / Slicing Saw

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New CE certified Precision Diamond Slicing / Dicing Saw is designed for Laboratory and R & D use. This machine can be used for slicing, dicing or cutting all kinds of materials up  4" diameter wafer or rectangular material up to 8"  length x 4" width x  1"in depth  saw is fully controlled by a computer ( any PC or Desktop computer) with position accuracy of 0.01 mm or better. The sample stage with two-angle adjustment comes with the machine, which allows customers to cut materials at desired angle with +/- 0.5 Deg tolerance. Variable speed up to 3,000 RPM (with option of extending out to 10,000 RPM). Accepts all types of blades. Including Precision Diamond Slicing, Dicing, & Wafering Blades from 3" to 6" in diameter. Such as Sintered (metal bond), Resin Bond, & Electroplated (nickel bond) hubless blades 1A1R, 1A8, 1A1, and etc. Affordable precision and cost effective dicing and cutting saw for R&D Labs in Materials and Micro-electronics Research. Typical applications that have benefited from the use of this machine include: wafers and sheets of optical, optoelectronic, semiconductor ceramic or related materials that need to be sectioned into smaller squares or rectangles. If this slicing/dicing saw can meet your needs in dicing and cutting, why do you have to pay more for an expensive dicing saw?  

Precision Diamond Saw Guide:


  • Dicing / Slicing Saw has 1/2 HP high torque DC motor with variable speed up to 3,000 rpm (variable speed up to 10,000 RPM optional) which can be operated at the voltage from AC 110V to 240 V. 

  • The cutting sample can be moved either by program or manual with X,Y, and Z three-dimension linear motion up to X = 8", Y=4" and Z = 4"
    The CNC controlled step motor operates with 0.0025 mm moving resolution and 0.01 mm position accuracy.

  • A user friendly software allows customers to cut, slice or dice automatically via using 486 IBM compatible computers, which are installed Windows XP, Windows 98 or  Windows Me system.

  • Your existing computer can be used to operate this saw. (computer laptop pre loaded with all software needed to operate machine is now included in the price of machine) 

  • One 4" dia x 0.3 mm thick fully sintered diamond blade, and two sets of flanges with 62 mm dia. ( for dicing ) and 42 mm dia ( for deep cutting) Included. 

  • One any blade specification from 75mm to 150mm OD any thickness from .006" to .060. any bond type sintered (metal bond), nickel bond or resin bond (your choice)

  • Assemblies of water jetting , draining, and splashing protection Included 

Technical Information

Standard Package Features:

1.  A cutting machine with a spindle motor and three step motors

2. One three-axis step motor driver with 3 cables to the CNC machine , and one cable to the computer system. (No computer included)

3. computer laptop pre loaded with all software needed to operate machine is now included. Software under Windows XP, Windows 98 or  Windows Me system.

4. All Accessories  necessary for you to begin operating, right out of the box. See Standard Package Features for more information. 

Dimensions: 580 L x 560 W x 660 H mm, & net weight of 28.5 Kg

Standard Package Features:

(Please click on thumb picture to enlarge image)


Items with machine


Standard Parts



Cross mount vise

1 pcs


Controller w/cables & software floppy

1 set


Mechanical  chuck



Water splash guard



Aluminum plate

2 pcs


Wax bulk for gluing samples

2 pcs


Graphite plate for holding samples 

2 pcs


Fully sintered diamond blade 4"x 0.3mm x 1/2"

1 pcs


 Select Right Wafering Blade for your application

 Chose any Diamond or CBN Wafering Blade. Sintered (metal bond), Resin Bond or Nickel Bond

How to select the Right Diamond Wafering Blade for your application >>>

Blade clamps (62 mm in dia.)

1 pair


Blade clamps (42 mmin dia.)

1 pair


4" Steel plate for holding samples

1 pcs


Screw drivers

1 set


Water hoses

1 set


Plastic splash-protection cover

1 set  

Operation manual in CD

1 set


Optional Accessories:

(Please click on thumb picture to enlarge image)

 4" Vacuum chuck


 4" Rotary table for precision dicing or cutting


 4" Vacuum chuck steel plate for holding samples


 110V Immersion water pump with a voltage converter for coolant circulation


 110V or 220V Vacuum pump for holding wafers


 Adhesive film for wafer holding


 Blade clamps (90 mm in dia.)


 Dicing blade clamps (85 mm in dia)


M25 (25x )stereo microscope with frame mechanism


Digital microscope head for M45 microscope with software

coolant circulating tank /pump

Water splash guard for covering 6" blade

86 mm dia x 0.1 mm ultra-thin diamond blade with flange

* Optional parts are not included in standard package.  And must be ordered  separately.  

dicing blades of almost any specification from thin as 100 microns to 1,000 microns can be used on this machine (almost any blade specification is available from stock)

Dicing Software now Windows XP Compatible

Examples of Diamond Slicing & Dicing Blades that can be used used with this Slicing / Dicing Saw


 SMART CUT™ Precision Diamond Sectioning have been successfully implemented and proven in hundreds of advanced materials and applications. SMART CUT™ Precision Manual and Semi-Automatic Saws provide Advanced Material Laboratories and Manufacturing Facilities consistent performance as fully automatic saws, at small fraction of the cost.  With ever increasing budget cuts, many facilities find the use of Precision Sawing/Sectioning Equipment and Consumables cost prohibitive. 

Fully automatic Precision Sawing machines usually cost several thousand and even tens thousands of dollars. Yet, most Advanced Material Manufacturing and R & D facilities very rarely require the functionality of high cost, automatic sectioning saws. SMART CUT™ series of Precision Diamond Saws have been designed to provide the material researcher or engineer the same capabilities they would expect from high cost automatic sectioning saws, at literally small fraction of the price. Start Saving Money Today!

We recognize that the Diamond Wafering / Sectioning Blade by itself is perhaps the most important factor in your sectioning / precision diamond sawing operation. The diamonds impregnated inside the bond matrix of the wafering blade, are what actually participate in cutting action. No matter how precision or well made your wafering saw. You will not be able to obtain the material surface finish, and precision tolerances you need, if the blade you are using is not right for your application. UKAM Industrial Superhard Tools proprietary blade chemistry, precision manufacturing methods, modern quality control methods, allow us to control and regulate the dozens of variables that affect blade life, quality of cut, surface finish. Reducing and often eliminating additional steps often required after sectioning. All blades are manufactured and available from inventory to fit your specific material, application, and surface finish requirements. We will work with you to determine your needs, and develop the right bond formulation, concentration, and grit sizes. SMART CUT™ Precision Diamond Wafering Blades are designed and specially selected to provide maximum possible blade life, for your desired cut quality and speed.

UKAM Industrial Superhard Tools is one of the Leading Diamond Wafering Blade Manufacturers, with one of the Largest Inventory of Precision Diamond Wafering Blades in the U.S. Over 4,000 diamond wafering blades in stock, available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness's.

You are sure to find the Right Diamond Wafering Blade for your

application in stock and ready for same day delivery. If you are

not using these blades, you are paying too much.

What you will save on the cost of consumables and Diamond Wafering Blades will more than pay for the saw in short period of time.




Selecting Right Dicing Blade

Dicing Operation Recommendations

Optimizing Dicing Blade Performance

Trouble Shooting Dicing Problems

Getting the most from your Diamond Tools

Application Recommendations & Case Studies

What you should know before you buy your next diamond blade?




 Recommend Site to Friend / Colleague

UKAM Industrial Superhard Tools   Division of LEL Diamond Tools International, Inc.

25345 Avenue Stanford, Unit 211  Valencia, CA 91355  Phone: (661) 257-2288  Fax: (661) 257-3833

e-mail: lel@ukam.com

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