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SMART CUT® 6012
Diamond Wire Saw (Lab)

SMART CUT® 6012 Miniature/Lab Precision wire saw is designed to provide a very smooth cutting for almost all kinds of materials, especially for very fragile crystals and substrates such as SrTiO3, YVO4, and GaAs etc. SMART CUT® 6012 by using either a diamond impregnated or a plain wire blade with abrasive slurry. It is an ideal saw for your needs of cutting valuable delicate and fragile crystals. It is a very helpful for your R&D and laboratory applications.

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A sample is mounted to a sample holder and attached to a work table on the base of the saw. An appropriate load is applied by adjusting the counterbalancing weight and the mechanical downstop is set. The sample is then positioned in any starting position relative to the wire blade and then a micrometer is used for precise sample positioning. With the wire rotating, the arm is gently lowered until the wire blade touches the sample.

SMART CUT® COOLANTS

Your choice of one (1) quart of SMART CUT™ Water Soluble Coolant or Mineral Oil is included with machine. SMART CUT™ Water Soluble Coolant Reduces material thermal stress, edge damage, and internal cracking, increases blade life, provides better cut quality, preserves material micro structure

Hence, assuring long-term integrity of material being sectioned. Since SMART CUT coolant is both a coolant and lubricant, both the wafering blade and material benefit. Mix ratio is 1:20 (1 part coolant, 20 parts water) on very hard and dense materials and 1:40 (1 part coolant, 40 parts water) on softer materials. Depending on mix ratio 1 quart will produce 5.7 to 9 gallons of coolant when mixed with water. As a coolant, SMART CUT KOOL reduces heat caused by friction. As a lubricant, SMART CUT KOOL lowers friction and surface tension, which increases swarf dispersion

LARGEST SELECTING OF DIAMOND &
CBN WAFERING BLADES AVAIALBLE

one (1) diamond wafering blade any specification is included FREE OF CHARGE with purchase of any machine (any specification). we have almost unlimited number of diamond & CBN wafering blade specifications in stock available for immediate delivery. Available in different sizes, thickness, arbor sizes, diamond concentrations, diamond mesh sizes, and bond hardness’s. With several thousand unique blade specification in stock not listed on our standard stock program. This insures you will receive the best blade specification possible for your specific application.

THE RIGHT DRESSING STICK FOR YOUR APPLICATION

One (1) dressing stick is included with the purchase of any machine free of charge. The dressing stick we supply is similar to the diamond size of the wafering blade you have chosen (or we recommended) for your application. Wafering Blades must be diamonds particles/crystals exposed properly through frequent dressing. Otherwise, the diamond tool will glaze over. They will begin to tear rather than grind which is very destructive. Tearing caused from unexposed diamonds creates friction. This causes uneven wear and/or heat cracks in the wafering blade and/or material being cut. Resulting in premature blade wear, blade tensioning problems, and will eventually destroy the blade. The more frequently the blade is dressed the freer and cooler it will cut with lot more consistency.

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