They have several layers of diamonds, held by a tough durable nickel alloy. Providing high  diamond  concentration, better diamond crystal retention and maximum diamond particle (grit) exposure/protrusion ratio. This provides freer,  faster cutting  action  with  minimum heat generation. Advantages of this type of technology include: longer tool life, more uniformity in performance, less stress to material being worked on, minimum material deformation, and better preservation of true material micro structure. This is specially important for more delicate, sensitive applications such as: glass, crystals, silicon wafers, carbon composites, sapphire, etc.

Electroplating is the only bond that allows different diamond crystal protrusion/exposure through use of different coating thicknesses. Usually the exposure ratio is based on the application (materials to be cut) The final specification depends primarily on the machining task and the associated necessary chip clearance space. For high-speed grinding the coating thickness should be about 30 to 40% of the grit particle diameter, when grinding or cutting glass fibre-reinforced plastics 30 to 50%, when machining ceramic material and cemented carbide 60 to 70%, and when machining stone up to 100%.